Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1792
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18924443 | METHOD OF PROCESSING SUBSTRATE USING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18609533 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18408986 | COMPOSITIONS AND METHODS OF USE THEREOF | Non-Final OA | Fujifilm Electronic Materials U.S.A, Inc |
| 17875458 | COMPOSITIONS AND METHODS OF USE THEREOF | Non-Final OA | Fujifilm Electronic Materials U.S.A., Inc. |
| 18730007 | COMPOSITION, ITS USE AND A PROCESS FOR SELECTIVELY ETCHING SILICON-GERMANIUM MATERIAL | Non-Final OA | BASF SE |
| 18709461 | ETCHANT AND METHOD FOR SELECTIVELY ETCHING TITANIUM DIOXIDE | Final Rejection | Microsoft Technology Licensing, LLC |
| 18394206 | SILICON ETCHING SOLUTION, METHOD OF TREATING SILICON SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | TOKUYAMA CORPORATION |
| 18477399 | POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18925695 | Subtractive Metal flow with Tip-to-Tip Critical Dimension Reduction | Non-Final OA | Applied Materials, Inc. |
| 18818964 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18918152 | ETCHING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18842620 | HARD MASK, SUBSTRATE PROCESSING METHOD, AND REMOVAL METHOD FOR HARD MASK | Non-Final OA | Tokyo Electron Limited |
| 18424262 | SELECTIVE ETCHING IN SEMICONDUCTOR DEVICES | Non-Final OA | Tokyo Electron Limited |
| 18376050 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18820797 | TITANIUM OXIDE-BASED CHEMICAL-MECHANICAL POLISHING COMPOSITION FOR HEAVILY-DOPED BORON SILICON FILMS | Final Rejection | ENTEGRIS, INC. |
| 18231926 | METHODS AND MATERIALS FOR POLISHING OF MATERIALS | Non-Final OA | ENTEGRIS, INC. |
| 18882142 | POLISHING COMPOSITION WITH PRINTED PARTICLES AND METHOD FOR FABRICATING PRINTED PARTICLES | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18794068 | POLISHING COMPOSITION WITH PRINTED PARTICLES AND METHOD FOR FABRICATING PRINTED PARTICLES | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18848121 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18615192 | CARBON HARD MASK, FILM FORMING APPARATUS, AND FILM FORMING METHOD | Final Rejection | National University Corporation Tokai National Higher Education and Research System |
| 18715108 | POLISHING SLURRY COMPOSITION | Final Rejection | KCTECH CO.,LTD. |
| 18088607 | SLURRY COMPOSITION FOR METAL FILM FOR CONTACT PROCESS | Final Rejection | KCTECH CO., LTD. |
| 18283083 | METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE FOR MEMORY ELEMENTS | Final Rejection | MITSUBISHI GAS CHEMICAL COMPANY, INC. |
| 18956558 | SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD, AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SEMES CO., LTD. |
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