Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1792
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18924443 | METHOD OF PROCESSING SUBSTRATE USING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18609533 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18408986 | COMPOSITIONS AND METHODS OF USE THEREOF | Non-Final OA | Fujifilm Electronic Materials U.S.A, Inc |
| 17875458 | COMPOSITIONS AND METHODS OF USE THEREOF | Non-Final OA | Fujifilm Electronic Materials U.S.A., Inc. |
| 18730007 | COMPOSITION, ITS USE AND A PROCESS FOR SELECTIVELY ETCHING SILICON-GERMANIUM MATERIAL | Non-Final OA | BASF SE |
| 18709461 | ETCHANT AND METHOD FOR SELECTIVELY ETCHING TITANIUM DIOXIDE | Final Rejection | Microsoft Technology Licensing, LLC |
| 18477399 | POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18925695 | Subtractive Metal flow with Tip-to-Tip Critical Dimension Reduction | Non-Final OA | Applied Materials, Inc. |
| 18818964 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18918152 | ETCHING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18842620 | HARD MASK, SUBSTRATE PROCESSING METHOD, AND REMOVAL METHOD FOR HARD MASK | Non-Final OA | Tokyo Electron Limited |
| 18424262 | SELECTIVE ETCHING IN SEMICONDUCTOR DEVICES | Non-Final OA | Tokyo Electron Limited |
| 18376050 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18882142 | POLISHING COMPOSITION WITH PRINTED PARTICLES AND METHOD FOR FABRICATING PRINTED PARTICLES | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18794068 | POLISHING COMPOSITION WITH PRINTED PARTICLES AND METHOD FOR FABRICATING PRINTED PARTICLES | Final Rejection | NANYA TECHNOLOGY CORPORATION |
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