Prosecution Insights
Last updated: October 02, 2026

Examiner: ALEJANDRO MULERO, LUZ L

Tech Center 1700 • Art Units: 1716 1792

This examiner grants 48% of resolved cases

Analysis

Luz L. Alejandro Mulero has 431 resolved cases in Tech Center 1700. The allowance rate is 47.8% and the interview lift is 40.2%. The median days to allowance is 1529. In Art Unit 1716, the 47.8% allowance rate is moderate, but the 40.2% interview lift is very high. The 1529-day median indicates a long prosecution timeline for 431 cases. The 40.2% lift is a key strategic insight.

The 47.8% allowance rate provides a baseline for success in Art Unit 1716. The 40.2% interview lift suggests that direct communication is highly beneficial. The 1529-day median is a significant duration for the 431 cases. Practitioners should prioritize interviews to leverage the 40.2% lift. These figures offer a detailed look at the examiner's history in Tech Center 1700. The 47.8% allowance rate is a key metric.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

47.8%
Allow Rate
-17.2% vs TC avg
454
Total Applications
+40.2%
Interview Lift
1529
Avg Prosecution Days
Based on 431 resolved cases, 2023–2026

Rejection Statute Breakdown

0.2%
§101 Eligibility
16.2%
§102 Novelty
50.0%
§103 Obviousness
23.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
19032149 METHODS AND SYSTEM FOR PRECURSOR RECYCLING Non-Final OA ASM IP Holding B.V.
16642187 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS Final Rejection Hitachi High-Technologies Corporation
17927328 DISTRIBUTED PLASMA SOURCE ARRAY Final Rejection LAM RESEARCH CORPORATION
18472267 SEMICONDUCTOR PROCESSING APPARATUS FOR GENERATING PLASMA Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
16927638 Pre-Clean for Contacts Final Rejection Taiwan Semiconductor Manufacturing Co., Ltd.
16898244 CLEAN UNIT FOR CHAMBER EXHAUST CLEANING Non-Final OA Applied Materials, Inc.
18487581 INDUCTIVELY COUPLED PLASMA ETCHING APPARATUS, AND INDUCTIVELY COUPLED PLASMA ETCHING METHOD USING SAME Non-Final OA KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
17749394 SINGLE-TURN AND LAMINATED-WALL INDUCTIVELY COUPLED PLASMA SOURCES Non-Final OA Advanced Energy Industries, Inc.
17626501 PLASMA ETCHING SYSTEM Final Rejection JIANGSU LEUVEN INSTRUMENTS CO. LTD

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