Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1724 2851 2882 2884 3652 3723
This examiner grants 83% of resolved cases
Mesfin T. Asfaw is an examiner in Art Unit 1724 of Tech Center 3700. The examiner has 988 resolved cases and an allowance rate of 83.0 percent. This high rate indicates that the majority of applications result in a patent grant. The median days to allowance is 977, which provides a clear expectation for the duration of the prosecution process for successful cases.
The interview lift is 13.8 percent, showing that interviews are a beneficial tool for increasing the 83.0 percent allowance rate. This positive lift suggests that direct communication can help resolve outstanding issues effectively. With 988 resolved cases, the data is robust and reflects a consistent pattern of high allowance. Practitioners can use the 977 median days to allowance to manage client expectations for timing in Art Unit 1724. The 13.8 percent lift reinforces the value of scheduling interviews to ensure a smooth path to allowance.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18955224 | METHOD OF USING LITHOGRAPHY APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18955256 | Method for evaluating at least one marker on a physical object for metrological detection of the object | Non-Final OA | ROBERT BOSCH GmbH |
| 19063911 | EXPOSURE APPARATUS, CONTROL METHOD THEREFOR, INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, NON-TRANSITORY COMPUTER READABLE MEDIUM, AND ARTICLE MANUFACTURING METHOD | Non-Final OA | CANON KABUSHIKI KAISHA |
| 19018323 | IMPRINT METHOD, MOLD, IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD | Non-Final OA | CANON KABUSHIKI KAISHA |
| 19036574 | SUBSTARATE PROCESSING APPARATUS WITH VUV INTENSITY CONTROL | Non-Final OA | ASM IP Holding B.V. |
| 19171607 | ION EXPOSURE METHOD AND APPARATUS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18947761 | NEW DESIGN OF EUV VESSEL PERIMETER FLOW AUTO ADJUSTMENT | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18588670 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18942306 | RETICLE POD WITH AIR FLOW MANAGEMENT FEATURE | Final Rejection | ENTEGRIS, INC. |
| 19044083 | LASER DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD | Non-Final OA | Gigaphoton Inc. |
| 19068695 | ILLUMINATION SYSTEM, RADIATION SOURCE APPARATUS, METHOD FOR ILLUMINATING A RETICLE, AND LITHOGRAPHY SYSTEM | Non-Final OA | Carl Zeiss SMT GmbH |
| 19063773 | INDIVIDUAL MIRROR OF A PUPIL FACET MIRROR AND PUPIL FACET MIRROR FOR AN ILLUMINATION OPTICAL UNIT OF A PROJECTION EXPOSURE APPARATUS | Non-Final OA | Carl Zeiss SMT GmbH |
| 19034100 | OPTICAL SYSTEM, LITHOGRAPHY MACHINE HAVING AN OPTICAL SYSTEM, AND METHOD FOR PRODUCING AN OPTICAL SYSTEM | Non-Final OA | Carl Zeiss SMT GmbH |
| 19008794 | APPARATUS AND METHOD FOR PROCESS-WINDOW CHARACTERIZATION | Non-Final OA | ASML NETHERLANDS B.V. |
| 18876559 | PROJECTION SYSTEM CONTROL | Non-Final OA | ASML Netherlands B.V. |
| 18843936 | METHOD FOR DETERMINING A SPATIAL DISTRIBUTION OF A PARAMETER OF INTEREST OVER AT LEAST ONE SUBSTRATE OR PORTION THEREOF | Final Rejection | ASML NETHERLANDS B.V. |
| 18705509 | DETERMINING AN ETCH EFFECT BASED ON AN ETCH BIAS DIRECTION | Non-Final OA | ASML NETHERLANDS B.V. |
| 19042393 | FIDUCIAL PATTERN ALIGNMENT TECHNIQUES | Non-Final OA | Onto Innovation Inc. |
| 19055718 | GAS PURGE SYSTEMS FOR A LASER SOURCE | Non-Final OA | Cymer, LLC |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18231727 | PHOTOMASK PROCESSING APPARATUS AND METHOD OF PROCESSING PHOTOMASK | Non-Final OA | SEMES CO., LTD. |
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