Tech Center 2800 • Art Units: 1726 2811 2817 2821 2822 2893
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18531071 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18351748 | METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18638582 | Direct Wire Reveal Package | Non-Final OA | Apple Inc. |
| 18264947 | SEMICONDUCTOR DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18598391 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18423763 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18387201 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18465982 | BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18765605 | Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor Pillars | Non-Final OA | Micron Technology, Inc. |
| 18736947 | ALIGNMENT MARK STRUCTURE AND METHOD FOR MAKING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18478086 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18227286 | SiC TRENCH BOTTOM CORNER ROUNDING | Final Rejection | Applied Materials, Inc. |
| 18216744 | DUAL FUNCTIONING ALIGNMENT AND ETCH BIAS STRUCTURES | Final Rejection | International Business Machines Corporation |
| 18067127 | LOW-RESISTANCE VIA TO BACKSIDE POWER RAIL | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18080721 | MEMORY CELLS WITH DARLINGTON PAIR BIPOLAR JUNCTION TRANSISTOR SELECTOR DEVICES | Non-Final OA | International Business Machines Corporation |
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