Listed by the USPTO as CHEN, DAVID Z
Tech Center 2800 • Art Units: 2811 2815
This examiner grants 45% of resolved cases
CHEN, DAVID Z is a USPTO patent examiner in tech center 2800 and art unit 2811. The record includes 695 resolved cases, an allowance rate of 45.0%, and a median of 1314 days to allowance. The interview lift is 50.2%, showing a substantial interview-associated difference relative to the overall allowance result.
The listed companies are Samsung Display Co., Ltd., Samsung Electronics Co., Ltd., and Taiwan Semiconductor Manufacturing Company, Ltd. The listed firms are JCIPRNET, HARNESS, DICKEY & PIERCE, P.L.C., and Muir Patent Law, PLLC. The data supports deliberate interview planning and careful management of prosecution timing in this docket.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18901283 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18612828 | CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18610790 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18507905 | TRANSISTOR, METHOD OF MANUFACTURING THE TRANSISTOR, ELECTRONIC DEVICE INCLUDING TRANSISTOR, AND ELECTRONIC APPARATUS INCLUDING THE TRANSISTOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18370149 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18611728 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18184413 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18522699 | Display Device | Final Rejection | LG Display Co., Ltd. |
| 18778606 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18608750 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18314993 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18024875 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | Non-Final OA | Samsung Display Co., LTD. |
| 18074182 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17993252 | DISPLAY DEVICE INCLUDING HEAT DISSIPATION PART AND MANUFACTURING METHOD FOR THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18568584 | LIGHT DETECTING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18006622 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18496902 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | Final Rejection | SEIKO EPSON CORPORATION |
| 18607986 | DIE PACKAGE WITH ENTANGLED VERTICAL INTERCONNECTS COUPLED TO A ROUTING SUBSTRATE FOR REDUCED ROUTING SUBSTRATE LAYERS, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18153984 | DISPLAY DEVICE HAVING BAND-PASS FILTER AND LIGHT CONVERSION LAYER | Final Rejection | Innolux Corporation |
| 18740858 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Kioxia Corporation |
| 17534224 | SELECTIVE HEAT SINK | Non-Final OA | BAE Systems Information and Electronic Systems Integration Inc. |
| 17551081 | TESTING SEMICONDUCTOR COMPONENTS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18832434 | METHOD FOR PRODUCING AN ARRAY OF LIGHT EMITTING ELEMENTS AND DISPLAY | Non-Final OA | Ams-OSRAM International GmbH |
| 18591695 | IN SITU REMOVABLE BLOCKING LAYER FORMATION | Non-Final OA | Tokyo Electron Limited |
| 18813018 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18741835 | SiC SEMICONDUCTOR DEVICE WITH INSULATING FILM AND ORGANIC INSULATING LAYER | Final Rejection | ROHM CO., LTD. |
| 18733880 | PACKAGE STRUCTURE WITH REWIRING LAYER AND METHOD OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17866532 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17837664 | GRAPHENE-CLAD METAL INTERCONNECT | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy45.0% of resolved applications examined by David Z Chen were allowed (695 resolved cases), compared with 72.2% across Art Unit 2811 over the last five years.
This examiner's interview lift is +50.2 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by David Z Chen took 1,314 days on average from filing to allowance.
David Z Chen examines applications in Art Unit 2811 in Tech Center 2800 (Semiconductors, Circuits & Optics).
