Technology area: Semiconductors, Circuits & Optics
18 pending office actions • 13 art units • 17 examiners • 0 of 18 (0%) have an AI response strategy ready • 53 patents granted in the last 365 days
Shanghai Huali Microelectronics Corporation has 17 pending office actions in Semiconductors, Circuits & Optics. The matters involve 16 distinct examiners and 12 distinct art units, reflecting a portfolio spread across numerous examination assignments and technical groups.
CHEN, DAVID Z is the busiest examiner, with 2 pending matters. The limited concentration at the busiest examiner indicates that most prosecution activity is distributed among other examiner relationships, so centralized docket control and consistent technical positions are important.
The difference between examiner and art-unit counts means some art units contain matters handled by more than one examiner. That structure creates an opportunity to coordinate unit-specific prior-art analysis while preserving separate examiner response strategies.
For counsel, the principal management issue is breadth of coordination rather than reliance on a single examiner dialogue. Reviewing related claim language and disclosure across the art-unit groupings can help identify recurring issues before responses are filed.
Based on the USPTO statutory response window for each pending office action. 3 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 3 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 1 (6%) |
| §101 + other | 1 (6%) |
| §103 only | 7 (39%) |
| Multi-statute (no §101) | 9 (50%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| CHEN, DAVID Z | 2 | 45.0% | +50.2% |
| SLUTSKER, JULIA | 1 | 76.9% | +12.7% |
| RAHMAN, MOHAMMAD A | 1 | 87.2% | +10.6% |
| LU, JIONG-PING | 1 | 83.6% | +7.9% |
| ESQUINO, CALEB LOGAN | 1 | 58.1% | +6.0% |
| LUONG, DUY HAN | 1 | 95.1% | +7.7% |
| MANG, LAL C | 1 | 75.6% | +18.1% |
| BRADFORD, PETER | 1 | 80.9% | +4.4% |
| CHOI, WOO H | 1 | 83.7% | -4.4% |
| NGUYEN, DUSTIN T | 1 | 72.6% | +17.8% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18744498 | THREE-PORT SRAM CIRCUIT | LUONG, DUY HAN | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17877324 | Method for Manufacturing Integrated Metal Resistance Layer | PRIDEMORE, NATHAN ANDREW | 1d overdue |
| 18810415 | METHOD FOR FORMING HYBRID SUBSTRATE OF SOI WAFER | SLUTSKER, JULIA | — |
| 18783225 | CIS PIXEL READOUT STRUCTURE AND METHOD FOR FABRICATING THE SAME | RAHMAN, MOHAMMAD A | — |
| 18778752 | POLYSILICON GATE ETCH METHOD | LU, JIONG-PING | — |
| 18778736 | METHOD FOR REDUCING RESISTANCE OF CONTACT | CHEN, DAVID Z | — |
| 18778718 | METHOD AND STRUCTURE FOR IMPROVING ESD PERFORMANCE OF METAL-GATE HIGH-VOLTAGE DEVICES | CHEN, DAVID Z | — |
| 18644604 | METHOD FOR REDUCING MEASUREMENT ERRORS IN CRITICAL PATTERN DIMENSIONS OF POLYCRYSTAL LAYERS | MANG, LAL C | — |
| 18612961 | SUPER FLASH AND METHOD FOR MANUFACTURING SAME | BRADFORD, PETER | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18810415 | METHOD FOR FORMING HYBRID SUBSTRATE OF SOI WAFER | SLUTSKER, JULIA | — |
| 18783225 | CIS PIXEL READOUT STRUCTURE AND METHOD FOR FABRICATING THE SAME | RAHMAN, MOHAMMAD A | — |
| 18778736 | METHOD FOR REDUCING RESISTANCE OF CONTACT | CHEN, DAVID Z | — |
| 18778718 | METHOD AND STRUCTURE FOR IMPROVING ESD PERFORMANCE OF METAL-GATE HIGH-VOLTAGE DEVICES | CHEN, DAVID Z | — |
| 18644604 | METHOD FOR REDUCING MEASUREMENT ERRORS IN CRITICAL PATTERN DIMENSIONS OF POLYCRYSTAL LAYERS | MANG, LAL C | — |
| 18406371 | Wafer Temperature Control System and Control Method, Computer Device, and Storage Medium | NGUYEN, DUSTIN T | — |
| Art Unit | Apps |
|---|---|
| 2897 | 3 |
| 2898 | 2 |
| 2857 | 2 |
| 2891 | 1 |
| 1713 | 1 |
| 2815 | 1 |
| 2677 | 1 |
| 2825 | 1 |
| 2827 | 1 |
| 3745 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18810415 | METHOD FOR FORMING HYBRID SUBSTRATE OF SOI WAFER | SLUTSKER, JULIA | 2891 | §103§112 | Non-Final OA | — | Pending | Aug 20, 2024 |
| 18783225 | CIS PIXEL READOUT STRUCTURE AND METHOD FOR FABRICATING THE SAME | RAHMAN, MOHAMMAD A | 2898 | §103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18778752 | POLYSILICON GATE ETCH METHOD | LU, JIONG-PING | 1713 | §102§103 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18778736 | METHOD FOR REDUCING RESISTANCE OF CONTACT | CHEN, DAVID Z | 2815 | §102§103 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18778718 | METHOD AND STRUCTURE FOR IMPROVING ESD PERFORMANCE OF METAL-GATE HIGH-VOLTAGE DEVICES | CHEN, DAVID Z | — | §103§112 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18748253 | METHOD FOR IMPROVING QUALITY OF CDSEM IMAGES | ESQUINO, CALEB LOGAN | 2677 | §103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18744498 | THREE-PORT SRAM CIRCUIT | LUONG, DUY HAN | 2825 | §103 | Final Rejection | — | Pending | Jun 14, 2024 |
| 18644604 | METHOD FOR REDUCING MEASUREMENT ERRORS IN CRITICAL PATTERN DIMENSIONS OF POLYCRYSTAL LAYERS | MANG, LAL C | 2857 | §101 | Final Rejection | — | Pending | Apr 24, 2024 |
| 18612961 | SUPER FLASH AND METHOD FOR MANUFACTURING SAME | BRADFORD, PETER | 2897 | §103§112 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18582183 | STATIC RANDOM-ACCESS MEMORY AND INTEGRATED CIRCUIT LAYOUT THEREOF | CHOI, WOO H | 2827 | §102§103 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18406371 | Wafer Temperature Control System and Control Method, Computer Device, and Storage Medium | NGUYEN, DUSTIN T | 3745 | §103§112 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18406465 | Wafer Polishing Locating Ring and Chemical Mechanical Polishing Device | DION, MARCEL T | 3723 | §103 | Non-Final OA | 36d | Pending | Jan 08, 2024 |
| 18465011 | METHOD FOR MEASURING THICKNESS OF SILICON EPITAXIAL LAYER | WEGNER, AARON MICHAEL | 2897 | §103 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18175092 | METHOD FOR MANUFACTURING SIGMA-SHAPED GROOVE | JUNGE, BRYAN R. | 2897 | §103 | Non-Final OA | 29d overdue | Pending | Feb 27, 2023 |
| 17877324 | Method for Manufacturing Integrated Metal Resistance Layer | PRIDEMORE, NATHAN ANDREW | 2898 | §103§112 | Non-Final OA | 1d overdue | Pending | Jul 29, 2022 |
| 17839313 | METHOD FOR MANUFACTURING METAL GATE MOS TRANSISTOR | NIELSEN, DEREK LANG | 2899 | §103 | Non-Final OA | — | Pending | Jun 13, 2022 |
| 18369939 | Method for Monitoring Ghost Image of Illumination Unit of Lithography Machine | CHOWDHURY, TARIFUR RASHID | 2877 | §103 | Non-Final OA | — | Pending | Sep 19, 2023 |
| 18368137 | Method and System for Analyzing Wafer Angle in Semiconductor Integrated Circuit Manufacturing | WALSH, RYAN D | 2857 | §101§102§112 | Non-Final OA | — | Pending | Sep 14, 2023 |
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Start Free TrialShanghai Huali Microelectronics Corporation has 18 pending office actions as of October 2026, spread across 13 art units and 17 examiners.
David Z Chen has the most, with 2 of Shanghai Huali Microelectronics Corporation's pending office actions.
Mostly Semiconductors, Circuits & Optics (USPTO Tech Center 2800), based on where its pending office actions are examined.
