Tech Center 2800 • Art Units: 2426 2818
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18402558 | STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED FOR THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18506346 | SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18523401 | WORDLINE CONTACT FORMATION FOR NAND DEVICE | Non-Final OA | Applied Materials, Inc. |
| 18128745 | ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELECTRONIC DEVICES | Non-Final OA | International Business Machines Corporation |
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