Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1713 1716 1784 1792 3723
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18603614 | CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18474849 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18252032 | METHOD FOR SELECTIVELY ETCHING A METAL COMPONENT | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18584540 | DIRECTIONAL SELECTIVE FILL USING HIGH DENSITY PLASMA | Non-Final OA | Applied Materials, Inc. |
| 18539892 | ETCHING SUBSTRATES USING VAPOR ADSORPTION | Final Rejection | Applied Materials, Inc. |
| 18588751 | VERTICAL FEATURE GROWTH USING FLUORINE-CONTAINING GAS | Non-Final OA | Tokyo Electron Limited |
| 18386601 | ETCHING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18248562 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18125206 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM | Non-Final OA | Tokyo Electron Limited |
| 18682767 | ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT | Non-Final OA | Resonac Corporation |
| 18127053 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | Final Rejection | Fujifilm Electronic Materials U.S.A., Inc. |
| 17699655 | POLISHING COMPOSITIONS AND METHODS OF USING THE SAME | Non-Final OA | Fujifilm Electronic Materials U.S.A., Inc. |
| 18622059 | MANUFACTURING METHOD OF MEMS DEVICE | Non-Final OA | Xintec Inc. |
| 18288270 | MULTI-LEVEL STRUCTURE FABRICATION | Non-Final OA | NILT Switzerland GmbH |
| 17923931 | PLASMA PROCESSING METHOD USING A MIXED PLASMA PROCESSING GAS OF C4F8 AND 2,3,3,3- TETRAFLUOROPROPENE | Final Rejection | SPP Technologies Co., Ltd. |
| 18213865 | Control of Trench Profile Angle in SiC Semiconductors | Non-Final OA | SPTS Technologies Limited |
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