Tech Center 2800 • Art Units: 2815 2855
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18435689 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18415754 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18705002 | DISPLAY SUBSTRATE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18478912 | WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE DEVICE | Non-Final OA | Texas Instruments Incorporated |
| 18592816 | HEMT DEVICE HAVING A REDUCED ON-RESISTANCE AND MANUFACTURING PROCESS THEREOF | Non-Final OA | STMicroelectronics International N.V. |
| 18486211 | INTEGRATED PROCESS FLOW FOR SENSOR PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18412190 | Power Semiconductor Device Having Improved Transient Handling Without Field Insulating Layer | Non-Final OA | Wolfspeed, Inc. |
| 18512642 | LIGHT EMITTING DIODE | Non-Final OA | Taiwan-Asia Semiconductor Corporation |
| 18618576 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Hubei Yangtze Industrial Innovation Center Of Advanced Display Co., Ltd. |
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