Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2815
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18415754 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18412576 | SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18410195 | One-Time Programming Memory Device with Backside Isolation Structure | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18618530 | EPI REGION WITH TRENCH EXTENSION AND WRAPAROUND CONTACT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18511265 | MERGED BACKSIDE CONTACT ISOLATION | Non-Final OA | International Business Machines Corporation |
| 18592816 | HEMT DEVICE HAVING A REDUCED ON-RESISTANCE AND MANUFACTURING PROCESS THEREOF | Non-Final OA | STMicroelectronics International N.V. |
| 18411230 | SELF-ALIGNED TRENCH BOTTOM PROTECTIVE REGION FOR A TRENCH-GATE METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR | Non-Final OA | STMicroelectronics International N.V. |
| 18512642 | LIGHT EMITTING DIODE | Non-Final OA | Taiwan-Asia Semiconductor Corporation |
| 18412190 | Power Semiconductor Device Having Improved Transient Handling Without Field Insulating Layer | Non-Final OA | Wolfspeed, Inc. |
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