Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2814 2819
This examiner grants 92% of resolved cases
Wasiul Haider examines applications in Art Unit 2812 of Tech Center 2800. The examiner has a high allowance rate of 92.0 percent across 551 resolved cases. This high rate indicates that the vast majority of applications reaching a final resolution under this examiner result in a grant. The 551 resolved cases provide a strong statistical basis for this conclusion.
The timeline for these grants is relatively efficient, with a median days to allowance of 710. Practitioners may find that interviews provide a helpful but not transformative advantage, as the interview lift is 6.4 percent. This lift adds to an already high 92.0 percent probability of success. The 710-day median pendency is a key factor for applicants prioritizing speed.
With 551 resolved cases, the data reflects a consistent and predictable prosecution style. The combination of a 710-day median pendency and a 92.0 percent allowance rate makes this art unit a productive environment for patent applicants in Tech Center 2800. The 6.4 percent interview lift remains a viable option for clarifying complex claim limitations.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18417937 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18380678 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18791072 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18538388 | LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING SAME | Non-Final OA | LG Display Co., Ltd. |
| 18538340 | LIGHT-EMITTING ELEMENT | Final Rejection | CANON KABUSHIKI KAISHA |
| 18827353 | ELECTRONIC COMPONENT | Non-Final OA | STMicroelectronics International N.V. |
| 18779804 | EPITAXIAL SOURCE/DRAIN STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18465192 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18741062 | SEMICONDUCTOR DEVICE HAVING LANDING PAD AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18668441 | SEMICONDUCTOR DEVICE HAVING LANDING PAD AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18838300 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRIBUTION LAYER CHIP, REDISTRIBUTION LAYER CHIP INTERMEDIATE, METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE INTERMEDIATE | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18463288 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT AND METHODS OF FORMING THE SAME | Final Rejection | GlobalFoundries U.S. Inc. |
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