Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2814 2819
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18403864 | CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18380424 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18392757 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Mitsubishi Electric Corporation |
| 18380678 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18521523 | THERMAL ISOLATION FOR HARDWARE COMPONENT PACKAGE | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18530784 | POWER SEMICONDUCTOR MODULE AND POWER CONVERTER | Non-Final OA | LX SEMICON CO., LTD. |
| 18475080 | INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING INDUCTIVELY COUPLED INDUCTORS SURROUNDED BY A MAGNETIC MATERIAL | Non-Final OA | QUALCOMM Incorporated |
| 18333189 | SEMICONDUCTOR DEVICES WITH ELECTRICAL FUSES AND METHODS OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17819367 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT | Non-Final OA | MACRONIX INTERNATIONAL CO., LTD. |
| 18237880 | PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
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