Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18140907 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18506623 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18509034 | SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF AND MEMORY SYSTEMS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18096236 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 18403326 | SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18315193 | ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESION PROMOTER LAYER | Non-Final OA | Infineon Technologies Austria AG |
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