Tech Center 2800 • Art Units: 2899
This examiner grants 93% of resolved cases
Daniel Johnathan Hibbert is an examiner in Art Unit 2899, part of Tech Center 2800. He has resolved 30 cases, which offers an emerging profile of his examination tendencies. His allowance rate is 93.3 percent, which is extremely high. This suggests that he is very open to finding allowable subject matter, making him a favorable examiner for applicants. The 30 resolved cases provide an initial baseline for evaluating his prosecution style in Art Unit 2899.
The interview lift for this examiner is 15.4 percent. Even with an exceptionally high baseline allowance rate of 93.3 percent, the data shows that interviews still provide a meaningful advantage. This 15.4 percent lift indicates that direct communication is a valuable strategy for resolving any remaining issues and reaching a favorable conclusion. Practitioners should view interviews as a highly effective supplement to their written arguments in Tech Center 2800.
However, the median days to allowance is 1271. This timeline is a bit longer than average, indicating that prosecution in Art Unit 2899 can be a deliberate process. Applicants should be prepared for a pendency of 1271 days. Despite the 1271-day median, the 93.3 percent allowance rate and the 15.4 percent interview lift provide a clear and encouraging roadmap for successful patent prosecution. The 1271-day duration is a vital metric for managing expectations.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18672392 | SEMICONDUCTOR DEVICE INCLUDING MULTI-HEIGHT SWITCH CELL COUPLED TO MULTIPLE GLOBAL POWER RAILS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18506623 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18767510 | LIGHT EMITTING DIODE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18751592 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18333711 | INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN | Final Rejection | Intel Corporation |
| 18057721 | SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 17886039 | ELECTRONIC COMPONENT WITH MOULDED PACKAGE | Final Rejection | MURATA MANUFACTURING CO., LTD. |
| 18140976 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED RELIABILITY AND A SEMICONDUCTOR DEVICE MODULE | Non-Final OA | Infineon Technologies Austria AG |
| 18403326 | SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18152314 | Water Cooling System for Semiconductor Package | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd |
| 18182552 | INTEGRATED SUBSTRATES AND RELATED METHODS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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