Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17872738 | SEMICONDUCTOR DEVCIE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 17886039 | ELECTRONIC COMPONENT WITH MOULDED PACKAGE | Final Rejection | MURATA MANUFACTURING CO., LTD. |
| 18128940 | LID ASSEMBLY FOR A CHIP PACKAGE | Final Rejection | ATI Technologies ULC |
| 18152314 | Water Cooling System for Semiconductor Package | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd |
| 18307151 | METAL FINGER STRUCTURE IN INPUT/OUTPUT OPENING OF IC CHIP | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18154143 | STRUCTURE INCLUDING MOISTURE BARRIER ALONG INPUT/OUTPUT OPENING AND RELATED METHOD | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18140388 | POTTED ELECTRONIC CIRCUIT | Final Rejection | SEMIKRON ELEKTRONIK GMBH &CO.KG |
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