Tech Center 2800 • Art Units: 2899
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18110233 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18334625 | SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME | Final Rejection | DENSO CORPORATION |
| 17872738 | SEMICONDUCTOR DEVCIE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18333711 | INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN | Non-Final OA | Intel Corporation |
| 17886039 | ELECTRONIC COMPONENT WITH MOULDED PACKAGE | Final Rejection | MURATA MANUFACTURING CO., LTD. |
| 18128940 | LID ASSEMBLY FOR A CHIP PACKAGE | Final Rejection | ATI Technologies ULC |
| 18152314 | Water Cooling System for Semiconductor Package | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd |
| 18182552 | INTEGRATED SUBSTRATES AND RELATED METHODS | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18193095 | POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR FOR AUTOMOTIVE APPLICATIONS, AND ASSEMBLING METHOD THEREOF | Final Rejection | STMICROELECTRONICS S.r.l. |
| 18307151 | METAL FINGER STRUCTURE IN INPUT/OUTPUT OPENING OF IC CHIP | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18140976 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED RELIABILITY AND A SEMICONDUCTOR DEVICE MODULE | Final Rejection | Infineon Technologies Austria AG |
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