Tech Center 2800 • Art Units: 2897
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18005849 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SUBSTRATE TREATMENT METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17044845 | DISPLAY SUBSTRATE, PREPARATION METHOD THEREOF AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 17707340 | RIBBON SHIELD DEVICE AND METHOD | Final Rejection | Intel Corporation |
| 17666616 | PROVIDING FILL PATTERNS FOR INTEGRATED CIRCUIT DEVICES | Final Rejection | Intel Corporation |
| 17133080 | METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Final Rejection | Intel Corporation |
| 17789558 | DISPLAY PANEL | Final Rejection | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 17736790 | NITRIDE SEMICONDUCTOR ELEMENT | Non-Final OA | Nichia Corporation |
| 18111959 | HIGH PERFORMANCE SILICON CONTROLLED RECTIFIER DEVICES | Non-Final OA | GlobalFoundries U.S. Inc. |
| 17896286 | Method for Improving Stability of Etching Rate of Etching Chamber | Final Rejection | Shanghai Huali Microelectronics Corporation |
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