Listed by the USPTO as KOO, LAMONT B
Tech Center 2800 • Art Units: 1774 2812 2813 2823 2824 2893 2899
This examiner grants 81% of resolved cases
Lamont B. Koo is an examiner in Tech Center 2800 and Art Unit 1774, with 556 resolved cases. He maintains an allowance rate of 80.6%, which is paired with a median days to allowance of 920. This combination suggests a prosecution path for companies like Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and Intel Corporation. The 920-day median is a benchmark for applicants in this tech center. The 80.6% allowance rate provides a baseline for success in Art Unit 1774.
The interview lift for this examiner is 5.2%. This 5.2% lift is an increase given the 80.6% base allowance rate, indicating that interviews are a helpful tactic. Firms such as Haynes and Boone, LLP (24061), Maschoff Brennan, and BIRCH STEWART KOLASCH & BIRCH, LLP may find that written advocacy is often sufficient. With 556 resolved cases, the data provides a consistent view of the environment in Art Unit 1774. The 920-day median pendency remains a reliable indicator of the expected timeline.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18514436 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18497363 | SEMICONDUCTOR DEVICE INCLUDING ESD DIODE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18295867 | SEMICONDUCTOR DEVICES | Final Rejection | Samsung Electronics Co., Ltd. |
| 18059044 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17961172 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18491802 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18486878 | LIGHT-EMITTING APPARATUS, DISPLAY APPARATUS, IMAGE PICKUP APPARATUS, AND ELECTRONIC APPARATUS | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18482444 | Light Emitting Diode Package and Manufacturing Method of The Same, and Light Emitting Device | Final Rejection | LG Display Co., Ltd. |
| 18505682 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18390952 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES FABRICATED USING ALTERNATE ETCH SELECTIVE MATERIAL | Final Rejection | Intel Corporation |
| 18516595 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITHOUT FIN END GAP | Final Rejection | Intel Corporation |
| 18333758 | INTEGRATED CIRCUIT DEVICE WITH MULTI-LENGTH GATE ELECTRODE | Final Rejection | Intel Corporation |
| 18070361 | Circuit Systems And Methods Using Spacer Dies | Non-Final OA | Intel Corporation |
| 18506245 | SEMICONDUCTOR DEVICE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18494611 | COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18754942 | INTEGRATED HIGH EFFICIENCY TRANSISTOR COOLING | Non-Final OA | Tokyo Electron Limited |
| 18356291 | EXTENDED BACKSIDE CONTACT IN STACK NANOSHEET | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18188496 | CONTACT CUT AND WRAP AROUND CONTACT | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18054133 | BACKSIDE CONTACT METAL FILL | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18775982 | SEMICONDUCTOR DEVICE WITH GATE ISOLATION STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18773200 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18749029 | SEMICONDUCTOR DEVICE HAVING CUT METAL GATE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18650905 | Gate Structures For Semiconductor Devices | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18630021 | SEMICONDUCTOR DEVICE WITH IMPROVED DEVICE PERFORMANCE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18415330 | SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18505632 | GATE ISOLATION FEATURES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18502297 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18447125 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18358522 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18298277 | Isolation Structures in Semiconductor Devices | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy80.6% of resolved applications examined by Lamont B Koo were allowed (556 resolved cases), compared with 58.5% across Art Unit 1774 over the last five years.
This examiner's interview lift is +5.2 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Lamont B Koo took 920 days on average from filing to allowance.
Lamont B Koo examines applications in Art Unit 1774 in Tech Center 2800 (Semiconductors, Circuits & Optics).
