Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 78% of resolved cases
Corbyn David Mellinger is a patent examiner in Tech Center 2800, working within Art Unit 2899. The examiner has 37 resolved cases and an allowance rate of 78.4 percent. This 78.4 percent rate reflects the proportion of applications that reach a grant. For the 37 cases handled, this data provides a basis for understanding the probability of success during the examination process. The volume of resolved cases reflects the examiner's experience within Tech Center 2800.
The median days to allowance for this examiner is 1209. This 1209-day timeline represents the duration for an application to move from filing to a grant. Applicants should consider this period when planning their patent strategy and resource allocation. The volume of 37 resolved cases suggests that this duration is a consistent aspect of the examiner's workflow in Art Unit 2899. This median provides a specific metric for evaluating the expected length of prosecution.
The data shows an interview lift of 40.0 percent. This 40.0 percent lift represents the change in the likelihood of allowance when an interview is conducted. It suggests that direct communication is a method for addressing the probability of a grant. For practitioners, utilizing an interview is an option to navigate the prosecution process and achieve a positive outcome. Practitioners can use this lift to evaluate the potential benefits of direct engagement.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17973702 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18106779 | CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR | Final Rejection | Toyota Motor Engineering & Manufacturing North America, Inc. |
| 18745280 | ELECTROLUMINESCENT DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18311230 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Innolux Corporation |
| 17955262 | LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS | Non-Final OA | Intel Corporation |
| 17685496 | PACKAGING ARCHITECTURE WITH ACTIVE COOLING | Non-Final OA | Intel Corporation |
| 17823515 | POWER DEVICE AND POWER MODULE | Final Rejection | DELTA ELECTRONICS, INC. |
| 18211669 | MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18345186 | OPEN CAVITY SENSOR | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17808175 | ANISOTROPIC WET ETCHING IN PATTERNING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18323484 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Final Rejection | WISTRON NEWEB CORPORATION |
| 18006921 | POWER MODULE PACKAGE AND METHOD OF FORMING THE SAME | Final Rejection | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
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