Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17973702 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18106779 | CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR | Non-Final OA | Toyota Motor Engineering & Manufacturing North America, Inc. |
| 18745280 | ELECTROLUMINESCENT DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18311230 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Innolux Corporation |
| 17955262 | LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS | Non-Final OA | Intel Corporation |
| 17953213 | SURFACE FINISH WITH METAL DOME | Non-Final OA | Intel Corporation |
| 17685496 | PACKAGING ARCHITECTURE WITH ACTIVE COOLING | Non-Final OA | Intel Corporation |
| 17823515 | POWER DEVICE AND POWER MODULE | Final Rejection | DELTA ELECTRONICS, INC. |
| 18345186 | OPEN CAVITY SENSOR | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17890199 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17808175 | ANISOTROPIC WET ETCHING IN PATTERNING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18356762 | MOLDED POWER SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Infineon Technologies AG |
| 18217008 | THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL | Non-Final OA | International Business Machines Corporation |
| 18211669 | MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18006921 | POWER MODULE PACKAGE AND METHOD OF FORMING THE SAME | Final Rejection | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy