Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18663234 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18637827 | SEMICONDUCTOR CHIP STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18413115 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18620250 | OXIDE SEMICONDUCTOR FERROELECTRIC FIELD EFFECT TRANSISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18413073 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18469618 | METAL TIP-TO-TIP SCALING | Non-Final OA | International Business Machines Corporation |
| 18675166 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18671451 | ESD PROTECTION CIRCUIT | Non-Final OA | Socionext Inc. |
| 18415775 | METHOD OF FABRICATING OXIDE FILM WITH UNIFORM THICKNESS | Final Rejection | DB HiTek Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy