Prosecution Insights
Last updated: October 01, 2026

Examiner: MOHAMED-ALY, KAREEM M

Tech Center 2800 • Art Units: 2898

This examiner grants 0% of resolved cases

Performance Statistics

—
Allow Rate
-68.0% vs TC avg
12
Total Applications
—
Interview Lift
0
Avg Prosecution Days
Based on 0 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
16.7%
§102 Novelty
74.0%
§103 Obviousness
6.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18808445 ELECTRONIC PACKAGE DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18738595 IMAGE SENSOR INCLUDING GROUND REGION Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18663234 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18413115 SEMICONDUCTOR PACKAGE Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18413281 NONVOLATILE MEMORY DEVICES AND METHODS OF FABRICATING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18608527 LIGHT EMITTING ELEMENT AND PRODUCTION METHOD THEREFOR Non-Final OA TOYODA GOSEI CO., LTD.
18696969 DISPLAY MODULES AND MANUFACTURING METHODS THEREOF Non-Final OA BOE Technology Group Co., Ltd.
18673791 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA SAMSUNG DISPLAY CO., LTD.
18614528 DISPLAY PANEL AND ELECTRONIC APPARATUS INCLUDING THE SAME Non-Final OA Samsung Display Co., Ltd.
18789984 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18417572 FLEXIBLE ELECTROLUMINESCENT DISPLAY DEVICE Non-Final OA LG DISPLAY CO., LTD.
18770313 SEMICONDUCTOR DEVICE Non-Final OA Mitsubishi Electric Corporation
18411422 MEMS ARM FOR MICROELECTROMECHANICAL SYSTEM Non-Final OA Taiwan Semiconductor Manufacturing Company, LTD.
18416410 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18675166 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Non-Final OA NANYA TECHNOLOGY CORPORATION
18741883 SEMICONDUCTOR DEVICE INCLUDING A BIPOLAR JUNCTION TRANSISTOR Non-Final OA Infineon Technologies AG
18647712 SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TRENCHES AND METHOD FOR FABRICATING THE SAME Non-Final OA Infineon Technologies AG
18806517 LAND GRID ARRAY PACKAGE WITH KELVIN CONTACTING Non-Final OA Analog Devices International Unlimited Company
18671451 ESD PROTECTION CIRCUIT Non-Final OA Socionext Inc.
18816716 SEMICONDUCTOR DEVICE Non-Final OA FUJI ELECTRIC CO., LTD.
18646110 SEMICONDUCTOR MODULE Non-Final OA FUJI ELECTRIC CO., LTD.

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