Tech Center 1700 • Art Units: 1716 1737 1792
This examiner grants 43% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18238874 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18331333 | APPARATUS FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18318832 | MASK FRAME, MASK ASSEMBLY, AND METHOD OF MANUFACTURING THE MASK ASSEMBLY | Non-Final OA | Samsung Display Co., Ltd. |
| 14839035 | DISPLAY APPARATUS MANUFACTURING APPARATUS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 17432284 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING PHOTOCATALYST | Final Rejection | EBARA CORPORATION |
| 18092362 | REMOTE PLASMA UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING REMOTE PLASMA | Non-Final OA | ASM IP Holding B.V. |
| 18258104 | MANUFACTURING EQUIPMENT OF DISPLAY DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 17122161 | HYDRIDE ENHANCED GROWTH RATES IN HYDRIDE VAPOR PHASE EPITAXY | Non-Final OA | Alliance for Sustainable Energy, LLC |
| 18423636 | Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving Substrate | Final Rejection | Applied Materials, Inc. |
| 18131212 | HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION | Non-Final OA | Applied Materials, Inc. |
| 17880310 | SINGLE PROCESS GAS FEED LINE ARCHITECTURE | Non-Final OA | Applied Materials, Inc. |
| 17537314 | METHOD AND APPARATUS FOR REALTIME WAFER POTENTIAL MEASUREMENT IN A PLASMA PROCESSING CHAMBER | Final Rejection | Applied Materials, Inc. |
| 16922931 | MULTI-LID STRUCTURE FOR SEMICONDUCTOR PROCESSING SYSTEM | Non-Final OA | Applied Materials, Inc. |
| 16718029 | SURFACE PROFILING AND TEXTURING OF CHAMBER COMPONENTS | Non-Final OA | APPLIED MATERIALS, INC. |
| 18163901 | DEPOSITION MASK AND METHOD FOR MANUFACTURING DEPOSITION MASK | Final Rejection | Dai Nippon Printing Co., Ltd. |
| 17902919 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17501889 | PLASMA PROCESSING APPARATUS | Final Rejection | TOKYO ELECTRON LIMITED |
| 17291713 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSPORT METHOD | Non-Final OA | Tokyo Electron Limited |
| 17961457 | COMPRESSIBLE TRAY FOR SOLID CHEMICAL VAPORIZING CHAMBER | Non-Final OA | ENTEGRIS, INC. |
| 17961470 | MODULAR TRAY FOR SOLID CHEMICAL VAPORIZING CHAMBER | Final Rejection | ENTEGRIS, INC. |
| 18787934 | VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18244616 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18189472 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 17313491 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18147473 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD | Non-Final OA | SEMES CO., LTD. |
| 17967172 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR OPERATING THEREOF | Non-Final OA | SEMES CO., LTD. |
| 17540742 | APPARATUS FOR GENERATING PLASMA, APPARATUS FOR TREATING SUBSTRATE INCLUDING THE SAME, AND METHOD FOR CONTROLLING THE SAME | Final Rejection | SEMES CO., LTD. |
| 17605264 | HIGH TEMPERATURE HEATING OF A SUBSTRATE IN A PROCESSING CHAMBER | Final Rejection | LAM RESEARCH CORPORATION |
| 16366392 | DEGASSING METHOD, DEGASSING CHAMBER, AND SEMICONDUCTOR PROCESSING APPARATUS | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 18065740 | FILM FORMATION APPARATUS AND METHOD OF USING THE SAME | Final Rejection | National University Corporation Kyoto Institute of Technology |
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