Tech Center 2800 • Art Units: 2835
This examiner grants 68% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18830384 | WEARABLE DEVICE INCLUDING HEAT DISSIPATION STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18216053 | DISPLAY APPARATUS WITH HEAT DISSIPATION MEMBER WITH A PLURALITY OF INSERTION HOLES COUPLEABLE TO A REAR CHASSIS WITH A PLURALITY OF COUPLING PROTRUSION | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18884693 | POWER SUPPLY DEVICE | Non-Final OA | Panasonic Automotive Systems Co., Ltd. |
| 18365702 | HEATSINK FOR ELECTRIC COMPONENT OF POWER EQUIPMENT, POWER EQUIPMENT INCLUDING SAME, AND METHOD | Final Rejection | Honda Motor Co., Ltd. |
| 18616219 | HEAT DISSIPATION APPARATUS AND SERVER | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18591608 | Expandable Panelboard Bus Assemblies and Methods of Assembling Same | Final Rejection | ABB Schweiz AG |
| 18562657 | ELECTRONIC DEVICE AND ELECTRIC POWER STEERING DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18652158 | DIMM HEAT SINK SYSTEM AND METHOD | Non-Final OA | Dell Products L.P. |
| 18643477 | UNIVERSAL PERIPHERAL COMPONENT INTERCONNECT EXPRESS ADD-IN CARD | Final Rejection | DELL PRODUCTS L.P. |
| 18349482 | ELECTROWETTING AND THERMOELECTRICS ASSISTED TWO PHASE COOLING OF POWER ELECTRONICS USING INTEGRATED COOLING | Non-Final OA | Hamilton Sundstrand Corporation |
| 18777890 | HEAT DISSIPATION ASSEMBLY FOR ELECTRONIC EQUIPMENT | Non-Final OA | ASIA VITAL COMPONENTS CO., LTD. |
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