Examiner: OH, JAEHWAN

Tech Center 2800 • Art Units: 2186 2816 2892 2898 2899

This examiner grants 85% of resolved cases

Analysis

Jaehwan Oh, based in Art Unit 2186 of Tech Center 2800, has managed 683 resolved cases. He demonstrates an allowance rate of 85.1% and a median time to allowance of 800 days. These metrics indicate a consistent prosecution environment for the 683 cases in his portfolio.

Applicants can further improve their chances through an interview, which provides a 10.2% interview lift. While the 85.1% baseline is already favorable, the 10.2% lift can be useful for resolving specific claim rejections. Given the 800-day median pendency, an interview remains a practical strategy to ensure a grant.

The 10.2% lift suggests that verbal communication is effective for this examiner. Practitioners should utilize the 800-day timeline to their advantage by engaging early. The 85.1% allowance rate reflects a high probability of success for those appearing before him in Tech Center 2800.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

85.1%

Allow Rate

+17.1% vs TC avg

690

Total Applications

+10.2%

Interview Lift

800

Avg Prosecution Days

Based on 683 resolved cases, 2023–2026

Rejection Statute Breakdown

1.0%

§101 Eligibility

36.3%

§102 Novelty

49.2%

§103 Obviousness

7.3%

§112 Clarity

Currently Pending Office Actions

App #	Title	Status	Assignee
18601032	SEMICONDUCTOR MEMORY DEVICE	Non-Final OA	SAMSUNG ELECTRONICS CO., LTD.
18544735	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE	Non-Final OA	SAMSUNG ELECTRONICS CO., LTD.
18743665	ELECTRONIC DEVICE	Non-Final OA	Samsung Display Co., Ltd.
18601059	SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE	Non-Final OA	TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
18798312	SEMICONDUCTOR MEMORY	Non-Final OA	Kioxia Corporation
18663776	POWER ALARM AND FIRE LOADING RISK REDUCTION FOR A DEPOSITION TOOL	Final Rejection	Taiwan Semiconductor Manufacturing Company, Ltd.
18672485	LOW-STRESS PASSIVATION LAYER	Non-Final OA	Taiwan Semiconductor Manufacturing Co., Ltd.
18752735	CHIP PACKAGE WITH MULTIPLE HBM STACKS	Non-Final OA	Advanced Micro Devices, Inc.

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