Tech Center 2800 • Art Units: 2186 2816 2892 2898 2899
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18518687 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18359031 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18366847 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18663776 | POWER ALARM AND FIRE LOADING RISK REDUCTION FOR A DEPOSITION TOOL | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18087318 | ELONGATED CONTACT FOR SOURCE OR DRAIN REGION | Non-Final OA | Intel Corporation |
| 18080612 | LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE | Non-Final OA | Intel Corporation |
| 18254870 | DISPLAY PANEL AND DISPLAY TERMINAL | Non-Final OA | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18476635 | MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18615403 | GATE STRUCTURE AND PATTERNING METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18506479 | SYSTEMS AND METHODS FOR COOLING AN INTEGRATED CIRCUIT | Non-Final OA | Advanced Micro Devices, Inc. |
| 18498644 | SYSTEMS AND METHODS FOR CONNECTING INTEGRATED CIRCUITS | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18321116 | PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18522349 | DISPLAY PANEL AND JOINABLE DISPLAY PANEL | Non-Final OA | Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18289620 | SEMICONDUCTOR PACKAGE IN CAMERA MODULE | Non-Final OA | ZINITIX CO., LTD. |
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