Tech Center 1700 • Art Units: 1759 1781 1784 1795
This examiner grants 54% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17727259 | STERILIZED WATER GENERATOR, WATER PURIFIER AND METHOD OF CONTROLLING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18471695 | WATER ELECTROLYSIS DEVICE AND WATER ELECTROLYSIS SYSTEM USING WATER ELECTROLYSIS DEVICE | Non-Final OA | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18264020 | GAS GENERATOR | Final Rejection | Panasonic Intellectual Property Management Co., Ltd. |
| 18183223 | ELECTRODE CATALYST INK OF WATER ELECTROLYSIS CELL, ELECTRODE CATALYST, WATER ELECTROLYSIS CELL, AND WATER ELECTROLYZER | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18418780 | CARBON DIOXIDE CONVERSION DEVICE | Non-Final OA | TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION |
| 18352378 | HYDROGEN SYSTEM OPERATION PLANNING DEVICE | Non-Final OA | TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION |
| 18106867 | POLYMER ELECTROLYTE WATER ELECTROLYZER BLOCKING MATERIAL | Non-Final OA | Robert Bosch GmbH |
| 17754110 | COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT | Final Rejection | BASF SE |
| 17154176 | Method of Electrodeposition of Electroactive Species at Solid-Solid Interfaces | Final Rejection | THE REGENTS OF THE UNIVERSITY OF MICHIGAN |
| 18564195 | GAS DIFFUSION LAYER FOR AN ELECTROCHEMICAL CELL AND ELECTROCHEMICAL CELL | Non-Final OA | Siemens Energy Global GmbH & Co. KG |
| 18027275 | ELECTROCHEMICAL SYSTEMS AND METHODS | Non-Final OA | Massachusetts Institute of Technology |
| 18167755 | WORKPIECE PLATING AND RINSE APPARATUS AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18530640 | FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING WAFER ELECTROPLATING | Non-Final OA | APPLIED Materials, Inc. |
| 17751955 | MODEL-BASED PARAMETER ADJUSTMENTS FOR DEPOSITION PROCESSES | Final Rejection | Applied Materials, Inc. |
| 18183156 | CATALYST CHANNELS WITH ANISOTROPIC STRUCTURES BY 3-D PRINTING | Final Rejection | City University of Hong Kong |
| 18082894 | PLATING METHOD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD | Non-Final OA | Nitto Denko Corporation |
| 18037537 | PROCESS KIT DE-BUBBLING | Final Rejection | Lam Research Corporation |
| 18348545 | WATER ELECTROLYZER | Final Rejection | SCREEN HOLDINGS CO., LTD. |
| 18087421 | METHODS OF LITHIATING ELECTROACTIVE MATERIALS | Non-Final OA | GM GLOBAL TECHNOLOGY OPERATIONS LLC |
| 18362444 | SYSTEMS AND METHODS FOR HIGH DENSITY ELECTROCHEMICAL ADDITIVE MANUFACTURING WITH CMOS MICROANODE ARRAY | Final Rejection | Lawrence Livermore National Security, LLC |
| 18111828 | SYSTEM AND METHOD FOR PRODUCING SUPERALLOYS UTILIZING ELECTRO-METALLURGY | Final Rejection | Spirit AeroSystems, Inc. |
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