Prosecution Insights
Last updated: August 18, 2026

Examiner: RUFO, LOUIS J

Tech Center 1700 • Art Units: 1759 1781 1784 1795

This examiner grants 54% of resolved cases

Performance Statistics

54.4%
Allow Rate
-10.6% vs TC avg
771
Total Applications
+23.2%
Interview Lift
1222
Avg Prosecution Days
Based on 713 resolved cases, 2023–2026

Rejection Statute Breakdown

0.8%
§101 Eligibility
24.9%
§102 Novelty
50.4%
§103 Obviousness
21.6%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
17727259 STERILIZED WATER GENERATOR, WATER PURIFIER AND METHOD OF CONTROLLING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18471695 WATER ELECTROLYSIS DEVICE AND WATER ELECTROLYSIS SYSTEM USING WATER ELECTROLYSIS DEVICE Non-Final OA TOYOTA JIDOSHA KABUSHIKI KAISHA
18264020 GAS GENERATOR Final Rejection Panasonic Intellectual Property Management Co., Ltd.
18183223 ELECTRODE CATALYST INK OF WATER ELECTROLYSIS CELL, ELECTRODE CATALYST, WATER ELECTROLYSIS CELL, AND WATER ELECTROLYZER Non-Final OA Panasonic Intellectual Property Management Co., Ltd.
18418780 CARBON DIOXIDE CONVERSION DEVICE Non-Final OA TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
18352378 HYDROGEN SYSTEM OPERATION PLANNING DEVICE Non-Final OA TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
18106867 POLYMER ELECTROLYTE WATER ELECTROLYZER BLOCKING MATERIAL Non-Final OA Robert Bosch GmbH
17754110 COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT Final Rejection BASF SE
17154176 Method of Electrodeposition of Electroactive Species at Solid-Solid Interfaces Final Rejection THE REGENTS OF THE UNIVERSITY OF MICHIGAN
18564195 GAS DIFFUSION LAYER FOR AN ELECTROCHEMICAL CELL AND ELECTROCHEMICAL CELL Non-Final OA Siemens Energy Global GmbH & Co. KG
18027275 ELECTROCHEMICAL SYSTEMS AND METHODS Non-Final OA Massachusetts Institute of Technology
18167755 WORKPIECE PLATING AND RINSE APPARATUS AND METHOD Final Rejection Taiwan Semiconductor Manufacturing Co., Ltd.
18530640 FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING WAFER ELECTROPLATING Non-Final OA APPLIED Materials, Inc.
17751955 MODEL-BASED PARAMETER ADJUSTMENTS FOR DEPOSITION PROCESSES Final Rejection Applied Materials, Inc.
18183156 CATALYST CHANNELS WITH ANISOTROPIC STRUCTURES BY 3-D PRINTING Final Rejection City University of Hong Kong
18082894 PLATING METHOD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD Non-Final OA Nitto Denko Corporation
18037537 PROCESS KIT DE-BUBBLING Final Rejection Lam Research Corporation
18348545 WATER ELECTROLYZER Final Rejection SCREEN HOLDINGS CO., LTD.
18087421 METHODS OF LITHIATING ELECTROACTIVE MATERIALS Non-Final OA GM GLOBAL TECHNOLOGY OPERATIONS LLC
18362444 SYSTEMS AND METHODS FOR HIGH DENSITY ELECTROCHEMICAL ADDITIVE MANUFACTURING WITH CMOS MICROANODE ARRAY Final Rejection Lawrence Livermore National Security, LLC
18111828 SYSTEM AND METHOD FOR PRODUCING SUPERALLOYS UTILIZING ELECTRO-METALLURGY Final Rejection Spirit AeroSystems, Inc.

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