Tech Center 2800 • Art Units: 2817 2891 2894
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18387933 | IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17741847 | VARIABLE RESISTANCE MEMORY DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18248817 | NITRIDE BASED ULTRAVIOLET LIGHT EMITTING DIODE WITH AN ULTRAVIOLET TRANSPARENT CONTACT | Non-Final OA | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
| 18024544 | LIGHT-EMITTING DEVICE, MANUFACTURING METHOD FOR LIGHT-EMITTING DEVICE, AND DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., LTD. |
| 17739776 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18246125 | TRANSFER SUBSTRATE USED IN MANUFACTURE OF DISPLAY DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18554244 | SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18304626 | PROCESS FOR THIN ELECTROLESS DEPOSITION | Non-Final OA | APPLIED Materials, Inc. |
| 17696447 | SUBSTRATE PROCESSING FOR GaN GROWTH | Final Rejection | Applied Materials, Inc. |
| 17752577 | Isolation Features For Semiconductor Devices And Methods Of Fabricating The Same | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18124132 | LIGHT EMITTING DIODE (LED) STRUCTURES FOR A MICROLED DEVICE, AND METHOD FOR PRODUCING AN ARRAY OF LED STRUCTURES | Non-Final OA | Board of Regents, The University of Texas System |
| 18159774 | SEMICONDUCTOR LIGHT-EMITTING ELEMENT | Final Rejection | ROHM Co., LTD. |
| 18554725 | METHOD FOR PREPARING A GERMANIUM SUBSTRATE AND GERMANIUM SUBSTRATE STRUCTURE FOR EPITAXIAL GROWTH OF A GERMANIUM LAYER | Non-Final OA | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
| 18030003 | METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 17879834 | Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 18554309 | HETERO-JUNCTION BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Nippon Telegraph and Telephone Corporation |
| 18446271 | MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT, SEMICONDUCTOR LAYER SUPPORT STRUCTURE, AND SEMICONDUCTOR SUBSTRATE | Non-Final OA | Oki Electric Industry Co., Ltd. |
| 17884980 | INTEGRATED CIRCUIT PACKAGE | Non-Final OA | STMicroelectronics (Grenoble 2) SAS |
| 18384138 | BURIED INTERCONNECT TRAVERSING TRENCH ISOLATION | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18174192 | LIGHT-EMITTING DEVICE AND METHOD FOR PRODUCING THE SAME | Final Rejection | XIAMEN SAN'AN OPTOELECTRONICS CO., LTD. |
| 18252347 | SEMICONDUCTOR STRUCTURE | Final Rejection | ENKRIS SEMICONDUCTOR, INC. |
| 18462798 | MICRO LIGHT-EMITTING DEVICE, MICRO LIGHT-EMITTING DIODE, AND METHOD FOR MANUFACTURING MICRO LIGHT-EMITTING DEVICE | Non-Final OA | HUAWEI DEVICE CO., LTD. |
| 18009655 | LIGHT-EMITTING DIODE EPITAXIAL WAFER, GROWTH METHOD THEREFOR, AND LIGHT-EMITTING DIODE CHIP | Non-Final OA | HC SEMITEK (SUZHOU) CO., LTD. |
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