Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2891 2894
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18246125 | TRANSFER SUBSTRATE USED IN MANUFACTURE OF DISPLAY DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR DISPLAY DEVICE | Final Rejection | LG ELECTRONICS INC. |
| 18641782 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18387997 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18094112 | NANOWIRE LED, DISPLAY MODULE INCLUDING THE NANOWIRE LED, AND METHOD FOR MANUFACTURING THE DISPLAY MODULE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18691539 | DISPLAY PANEL AND MANUFACTURE METHOD THEREOF, DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18407438 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18024544 | LIGHT-EMITTING DEVICE, MANUFACTURING METHOD FOR LIGHT-EMITTING DEVICE, AND DISPLAY APPARATUS | Final Rejection | Samsung Display Co., LTD. |
| 18770544 | LED TRANSFER METHOD AND MANUFACTURING METHOD OF DISPLAY DEVICE USING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 18367184 | LIGHT-EMITTING DEVICE, DISPLAY APPARATUS INCLUDING THE SAME AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | LG DISPLAY CO., LTD. |
| 18462798 | MICRO LIGHT-EMITTING DEVICE, MICRO LIGHT-EMITTING DIODE, AND METHOD FOR MANUFACTURING MICRO LIGHT-EMITTING DEVICE | Final Rejection | HUAWEI DEVICE CO., LTD. |
| 18770162 | LUMIPHORIC MATERIAL STRUCTURES WITHIN LIGHT-EMITTING DIODES AND RELATED METHODS | Non-Final OA | CreeLED, Inc. |
| 18248817 | NITRIDE BASED ULTRAVIOLET LIGHT EMITTING DIODE WITH AN ULTRAVIOLET TRANSPARENT CONTACT | Non-Final OA | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
| 18291311 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18700657 | THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING DISPLAY SUBSTRATE | Non-Final OA | Beijing BOE Technology Development Co., Ltd. |
| 16790363 | TRAINING OF VARIATIONAL QUANTUM CLASSIFIERS BY PARAMETRIC COORDINATE ASCENT | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18779097 | SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17721814 | NEUROMORPHIC FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICE WITH ANTI-FERROELECTRIC BUFFER LAYER | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18736157 | PRECLEAN AND ENCAPSULATION OF MICROLED FEATURES | Non-Final OA | Applied Materials, Inc. |
| 18304626 | PROCESS FOR THIN ELECTROLESS DEPOSITION | Final Rejection | APPLIED Materials, Inc. |
| 18393114 | ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPORARY PLUG | Non-Final OA | Microchip Technology Incorporated |
| 18124132 | LIGHT EMITTING DIODE (LED) STRUCTURES FOR A MICROLED DEVICE, AND METHOD FOR PRODUCING AN ARRAY OF LED STRUCTURES | Non-Final OA | Board of Regents, The University of Texas System |
| 17736720 | DYNAMIC PERFORMANCE OF ON-CHIP CURRENT SENSORS | Final Rejection | Wolfspeed, Inc. |
| 18726138 | LASER PROCESSING METHOD AND LASER PROCESSING DEVICE | Non-Final OA | HAMAMATSU PHOTONICS K.K. |
| 18284615 | METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR WAFER | Final Rejection | SHIN-ETSU HANDOTAI CO., LTD. |
| 18384386 | SEMICONDUCTOR PACKAGE | Final Rejection | JMJ Korea Co., Ltd. |
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