Listed by the USPTO as SPALLA, DAVID C
Tech Center 2800 • Art Units: 2811 2815 2818 2821 2893 2896
This examiner grants 84% of resolved cases
SPALLA, DAVID C works in tech center 2800 and art unit 2811. The record includes 857 resolved cases, an allowance rate of 84.5%, and a median of 845 days to allowance. The substantial case volume supports a meaningful review of examiner history, and the allowance rate indicates that successful outcomes form a clear majority of the record.
Interviews are associated with a 4.7% lift in allowance rate, indicating a limited but positive recorded relationship. Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and Toyoda Gosei Co., Ltd. are the leading companies. The listed firms are Haynes and Boone, LLP (24061), BIRCH STEWART KOLASCH & BIRCH, LLP, and HOFFMAN WARNICK LLC.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18626691 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18687829 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18083994 | STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER | Final Rejection | International Business Machines Corporation |
| 18917587 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SEMICONDUCTOR DEVICE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18786797 | FIELD-EFFECT TRANSISTOR DEVICE WITH GATE SPACER STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18787005 | POST-FORMATION MENDS OF DIELECTRIC FEATURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18780150 | INNER SPACER FEATURES FOR MULTI-GATE TRANSISTORS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18779444 | Source/Drain Contact with Low-K Contact Etch Stop Layer and Method of Fabricating Thereof | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18798180 | CROSS-POINT SPIN-ORBIT TORQUE MAGNETORESISTIVE MEMORY ARRAY AND METHOD OF MAKING THE SAME | Non-Final OA | Sandisk Technologies, Inc. |
| 18813074 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18583397 | FOLDED CASCODE LOW NOISE AMPLIFIER | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18670484 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy84.5% of resolved applications examined by David C Spalla were allowed (857 resolved cases), compared with 72.2% across Art Unit 2811 over the last five years.
This examiner's interview lift is +4.7 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by David C Spalla took 845 days on average from filing to allowance.
David C Spalla examines applications in Art Unit 2811 in Tech Center 2800 (Semiconductors, Circuits & Optics).
