Listed by the USPTO as STARK, JARRETT J
Tech Center 2800 • Art Units: 2822 2823 2898
This examiner grants 70% of resolved cases
STARK, JARRETT J works in USPTO Technology Center 2800, Art Unit 2822. Across 1299 resolved cases, the allowance rate is 70.4%, and the median time to allowance is 996 days. Interview lift is 11.0%, so interviews provide a modest additional signal relative to the favorable allowance rate.
The principal companies are Samsung Display Co., Ltd., Intel Corporation, and Texas Instruments Incorporated. The leading firms are JCIPRNET, F. CHAU & ASSOCIATES, LLC, and PVIP. The substantial case volume supports practical benchmarking, while the median timing and allowance rate together offer a useful foundation for prosecution scheduling and response planning.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18451810 | DEFECT REMOVAL DEVICE, DEFECT REMOVAL METHOD, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18418765 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18236673 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18902281 | SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18676722 | DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTURING METHOD | Non-Final OA | Samsung Display Co., LTD. |
| 18666575 | WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18658562 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18623873 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., LTD. |
| 18834411 | SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18713212 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18699682 | STAMP, METHOD FOR MANUFACTURING THE SAME, TRANSFER DEVICE, AND MASS TRANSFER METHOD | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18749657 | SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18399435 | SUBSTRATE HAVING ASYMMETRIC METALLIZATION STRUCTURES DISPOSED ON OPPOSITE SIDES OF A CENTRAL CORE | Final Rejection | QUALCOMM Incorporated |
| 18244689 | PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES | Final Rejection | Intel Corporation |
| 18216909 | INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-SIDED DEVICES | Non-Final OA | Intel Corporation |
| 18129737 | METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY | Final Rejection | Intel Corporation |
| 18234603 | POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE | Non-Final OA | General Electric Company |
| 18582682 | DISPLAY DEVICE | Final Rejection | Innolux Corporation |
| 18553602 | SUPERLATTICE, FERROIC ORDER THIN FILMS FOR USE AS HIGH/NEGATIVE-K DIELECTRIC | Non-Final OA | The Regents of the University of California |
| 18412826 | INTEGRATED CIRCUIT WITH A PROTECTIVE LAYER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18458794 | INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18455163 | CAVITY INTEGRATED CIRCUIT | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18444183 | SEMICONDUCTOR PACKAGE INCLUDING ENCAPSULATION LAYERS | Final Rejection | SK hynix Inc. |
| 18611641 | SUBSTRATE WITH SUPPORT AND SEMICONDUCTOR DEVICE | Non-Final OA | TOPPAN HOLDINGS INC. |
| 18805794 | SEMICONDUCTOR DEVICE | Non-Final OA | Rohm Co., Ltd. |
| 18591976 | DIETHYL ZINC AND METAL HALIDE PRECURSORS FOR DEPOSITION OF METAL FILMS ON SEMICONDUCTOR SUBSTRATES | Final Rejection | Applied Materials, Inc. |
| 18432955 | TEMPORAL CONTROL OF PLASMA PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 18383100 | SURFACE MODIFIERS FOR ENHANCED EPITAXIAL NUCLEATION AND WETTING | Final Rejection | Applied Materials, Inc. |
| 18391546 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18558177 | DISPLAY PANEL AND ELECTRONIC DEVICE | Final Rejection | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy70.4% of resolved applications examined by Jarrett J Stark were allowed (1,299 resolved cases), compared with 48.4% across Art Unit 2822 over the last five years.
This examiner's interview lift is +11.0 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Jarrett J Stark took 996 days on average from filing to allowance.
Jarrett J Stark examines applications in Art Unit 2822 in Tech Center 2800 (Semiconductors, Circuits & Optics).
