Tech Center 2800 • Art Units: 2815 2823
This examiner grants 75% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18217701 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17828170 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND METHODS OF FABRICATING THE DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17742667 | COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17683201 | THROUGH WAFER ISOLATION ELEMENT BACKSIDE PROCESSING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18264194 | AI MODULE | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18233136 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | LX SEMICON CO., LTD. |
| 18265578 | BONDED CONNECTION MEANS | Non-Final OA | Siemens Aktiengesellschaft |
| 17579487 | HIGH THROUGHPUT DEPOSITION PROCESS | Final Rejection | ENTEGRIS, INC. |
| 17901272 | METAL STACKS FOR LIGHT EMITTING DIODES FOR BONDING AND/OR OHMIC CONTACT-REFLECTIVE MATERIAL | Final Rejection | Lumileds LLC |
| 18007208 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 17976215 | STACK PACKAGE INCLUDING SEMICONDUCTOR DIES AND ENCAPSULANT | Final Rejection | SK hynix Inc. |
| 17529562 | METHOD OF FORMING STRUCTURES FOR THRESHOLD VOLTAGE CONTROL | Non-Final OA | ASM IP Holding B.V. |
| 18969620 | SOLAR CELL STRUCTURE, METHOD FOR MANUFACTURING SOLAR CELL STRUCTURE, AND SOLAR CELL | Non-Final OA | YINGKOU JINCHEN MACHINERY CO., LTD. |
| 18314248 | CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 17834767 | SENSORS, IMAGING SYSTEMS, AND METHODS FOR FORMING A SENSOR | Non-Final OA | KLA Corporation |
| 18119797 | METASURFACE STRUCTURE AND FABRICATION METHOD THEREOF | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18230221 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED BY THE METHOD | Non-Final OA | Siliconix Incorporated |
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