Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2818 2896 4100
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18633688 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18423003 | INTEGRATED CIRCUIT ASSEMBLY WITH DIE COUPLED TO LID | Non-Final OA | Apple Inc. |
| 18704500 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18604563 | LIGHT EMITTING ELEMENT, DISPLAY DEVICE, AND METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT | Non-Final OA | Samsung Display Co., LTD. |
| 17531561 | DEVICES AND METHODS INVOLVING DIAMOND-BASED PHOTOCONDUCTIVE STRUCTURES | Non-Final OA | The Board of Trustees of the Leland Stanford Junior University |
| 18771578 | CAPPING STRUCTURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18766336 | BSI CHIP WITH BACKSIDE ALIGNMENT MARK | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18581153 | TRANSISTORS HAVING NANOSTRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
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