Tech Center 4100 • Art Units: 2818 2896 4100
This examiner grants 88% of resolved cases
Earl N. Taylor works in Tech Center 4100 and Art Unit 2818. With 882 resolved cases, the examiner has an allowance rate of 88.1 percent. This is a high rate, suggesting a high likelihood of success for applicants. The interview lift is 6.3 percent, which is modest but still positive. Practitioners should note that while the baseline allowance rate is strong, interviews still provide a measurable benefit in Art Unit 2818.
The median days to allowance is 792. This timeframe is efficient for the 882 cases handled. Given the 88.1 percent allowance rate, practitioners can be optimistic about the outcome of their applications. The 792-day median wait for a final grant provides a specific timeline for planning. With 882 cases resolved, the examiner has a well-established track record in Tech Center 4100. The 6.3 percent interview lift can be used to resolve any final technical issues that arise during prosecution.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18738410 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18633688 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18515449 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18797081 | DISPLAY DEVICE INCLUDING REFLECTION LAYER AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18781008 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18771578 | CAPPING STRUCTURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18766336 | BSI CHIP WITH BACKSIDE ALIGNMENT MARK | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18746181 | Contact for Semiconductor Device and Method of Forming Thereof | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18825485 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18652527 | FLIP-CHIP PACKAGE HEAT SPREADER | Non-Final OA | Tektronix, Inc. |
| 18230977 | ASYMMETRIC JUNCTIONLESS FIN FIELD EFFECT TRANSISTORS | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
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