Tech Center 2800 • Art Units: 1713 1716 1781 1792 2813
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18627835 | PRODUCING GRATINGS IN OPTICAL SUBSTRATES USING NEUTRALIZED ION BEAM ETCHING | Non-Final OA | GOOGLE LLC |
| 18939793 | MASK, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING DISPLAY PANEL | Non-Final OA | Samsung Display Co., Ltd. |
| 18603578 | TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR AND METHOD OF TREATING OBJECT TO BE TREATED | Final Rejection | FUJIFILM Corporation |
| 18147636 | ION BEAM LITHOGRAPHY AND NANOENGINEERING | Non-Final OA | Intel Corporation |
| 18727238 | LASER MICROMACHINING OF MEMS RESONATORS FROM BULK OPTICALLY TRANSPARENT MATERIAL | Non-Final OA | The Regents of the University of California |
| 18743610 | IN-SITU ETCHING OF GALLIUM OXIDE WITH METAL ORGANIC GALLIUM PRECURSORS | Non-Final OA | ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY |
| 18919172 | PROCESSING METHODS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATERIAL SURFACE PROPERTIES | Non-Final OA | Applied Materials, Inc. |
| 18805790 | SELECTIVE ETCHING OF SILICON-CONTAINING MATERIAL | Non-Final OA | Applied Materials, Inc. |
| 18603360 | SELECTIVE OXIDATION PROCESSES FOR GATE-ALL-AROUND TRANSISTORS | Non-Final OA | Applied Materials, Inc. |
| 18379102 | DESIGN, CONTROL, AND OPTIMIZATION OF PHOTOSENSITIVITY MODULATION ALONG PHOTORESIST FILM DEPTH | Non-Final OA | Applied Materials, Inc. |
| 18212672 | ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION | Non-Final OA | Applied Materials, Inc. |
| 18441719 | PROTECTION STRUCTURE FOR LINER REMOVAL | Non-Final OA | Tokyo Electron Limited |
| 18395788 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18482401 | SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18368110 | ETCHING METHOD AND ETCHING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18466613 | TUNABLE PATTERNED SURFACE UNIFORMITY USING DIRECT CURRENT BIAS | Non-Final OA | Tokyo Electron Limited |
| 18813036 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18697669 | PATTERNING METHODS FOR PHOTONIC DEVICES | Final Rejection | PSIQUANTUM CORP. |
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