Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1716 1781 1792
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18603578 | TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR AND METHOD OF TREATING OBJECT TO BE TREATED | Non-Final OA | FUJIFILM Corporation |
| 18435853 | DEPOSITION AND ETCHING FOR SELECTIVE REMOVAL OF DEPOSITED DIELECTRIC FILM FROM TOPS OF FINS | Non-Final OA | Applied Materials, Inc. |
| 18232985 | METHODS OF ETCHING CARBON-CONTAINING FEATURES AT LOW TEMPERATURES | Non-Final OA | Applied Materials, Inc. |
| 18096207 | PHOTOLITHOGRAPHY ENHANCEMENT TECHNIQUES | Non-Final OA | Applied Materials, Inc. |
| 17698024 | METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE | Final Rejection | Intel Corporation |
| 18298114 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18482401 | SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18466613 | TUNABLE PATTERNED SURFACE UNIFORMITY USING DIRECT CURRENT BIAS | Final Rejection | Tokyo Electron Limited |
| 18691760 | PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18683501 | METHOD AND APPARATUS FOR ETCHING A CARBON CONTAINING LAYER | Non-Final OA | Lam Research Corporation |
| 18596278 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE | Non-Final OA | FUJIMI INCORPORATED |
| 18684991 | POLISHING COMPOSITION, POLISHING COMPOSITION PRODUCTION METHOD, POLISHING METHOD, AND SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD | Non-Final OA | FUJIMI INCORPORATED |
| 18293322 | PLASMA TREATMENT METHOD | Non-Final OA | JIANGSU LEUVEN INSTRUMENTS CO., LTD. |
| 18409628 | Functionalized Carbon Particle CMP Slurry Dispersion | Non-Final OA | DuPont Electronic Materials Holdings, Inc. |
| 18392584 | SELECTIVE THIN FILM RESISTOR AND METHODS FOR MAKING SAME | Non-Final OA | Greensource Fabrication LLC |
| 18135558 | Semiconductor Structure and Method for Forming the Same | Non-Final OA | HUA HONG SEMICONDUCTOR (WUXI) LIMITED |
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