Listed by the USPTO as WEGNER, AARON MICHAEL
Tech Center 2800 • Art Units: 2897
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18889963 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO, LTD. |
| 18889604 | SEMICONDUCTOR MEMORY DEVICE INCLUDING THREE-DIMENSIONALLY ARRANGED MEMORY CELLS AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18363637 | COMMON OUTPUT IN 3D STACK FET | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18180366 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18080013 | SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18227911 | SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME | Final Rejection | LX SEMICON CO., LTD. |
| 18421394 | DISPLAY DEVICE | Final Rejection | LG DISPLAY CO., LTD. |
| 17711434 | GATE SPACERS WITH ADJACENT UNIFORM EPITAXIAL MATERIAL | Non-Final OA | Intel Corporation |
| 17559916 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING NEIGHBORING FIN-BASED DEVICES | Final Rejection | Intel Corporation |
| 17556520 | CONDUCTIVE FEATURES FORMED USING METAL ASSISTED ETCH | Final Rejection | Intel Corporation |
| 17406480 | SELF-ALIGNED GATE CUT STRUCTURES | Final Rejection | Intel Corporation |
| 17350169 | COAXIAL STRUCTURE IN A GLASS SUBSTRATE | Non-Final OA | Intel Corporation |
| 17893436 | Memory Circuitry And Method Used In Forming Memory Circuitry | Non-Final OA | Micron Technology, Inc. |
| 17885018 | MEMORY DEVICE INCLUDING DIELECTRIC STRUCTURES HAVING REPEATING PATTERNS | Non-Final OA | Micron Technology, Inc. |
| 17930541 | TEMPERATURE MEASUREMENT METHOD, SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 17929428 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 17901606 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Kioxia Corporation |
| 18898846 | HIGH-FREQUENCY MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18106499 | SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE | Non-Final OA | MEDIATEK INC. |
| 18305653 | NANOWIRE FLASH MEMORY WITH SEPARATED SOURCE/DRAIN REGIONS | Non-Final OA | International Business Machines Corporation |
| 18306187 | METHOD OF METROLOGY ON PATTERN WAFER USING REFLECTOMETRY | Final Rejection | Applied Materials, Inc. |
| 17970336 | COOLING OF AN ELECTRONIC DEVICE | Non-Final OA | STMICROELECTRONICS (GRENOBLE 2) SAS |
| 18438538 | DUAL DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18492359 | SEMICONDUCTOR STRUCTURES AND METHODS WITH REDUCED PLASMA INDUCED DAMAGE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17905176 | SEMICONDUCTOR DEVICE, SENSOR DEVICE, AND ELECTRONIC DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy75.6% of resolved applications examined by Aaron Michael Wegner were allowed (41 resolved cases), compared with 82.9% across Art Unit 2897 over the last five years.
This examiner's interview lift is -3.6 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Aaron Michael Wegner took 1,270 days on average from filing to allowance.
Aaron Michael Wegner examines applications in Art Unit 2897 in Tech Center 2800 (Semiconductors, Circuits & Optics).
