Technology area: Semiconductors, Circuits & Optics
4 pending office actions • 2 art units • 3 examiners • 0 of 4 (0%) have an AI response strategy ready • 1 patents granted in the last 365 days
Yibu Semiconductor Co. Ltd. manages 3 pending office actions within the Semiconductors, Circuits & Optics technology area. These actions are handled by 3 distinct examiners across 2 distinct art units, suggesting some overlap in art unit assignment despite the variety of examiners. This structure indicates that while the examiners are different, the subject matter may be closely related enough to fall within the same administrative groups.
STARK, JARRETT J is the busiest examiner with 1 pending office action. Since the portfolio has 3 actions and 3 examiners, each examiner is managing exactly 1 action. The fact that these 3 actions are contained within only 2 distinct art units suggests a higher density of prosecution within specific technical silos compared to portfolios where every action is in a different art unit, requiring a coordinated strategy across the 2 distinct art units.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §102 only | 1 (25%) |
| Multi-statute (no §101) | 3 (75%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| STARK, JARRETT J | 2 | 70.5% | +11.5% |
| KARIMY, TIMOR | 1 | 82.2% | +9.6% |
| AU, BAC H | 1 | 80.9% | +11.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18401325 | STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE | KARIMY, TIMOR | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18754081 | CHIP STACK AND FABRICATION METHOD | STARK, JARRETT J | — |
| 18664273 | MULTI-CHIP PACKAGE AND METHOD OF MAKING | STARK, JARRETT J | — |
| 18401329 | FAN-OUT STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE | AU, BAC H | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18754081 | CHIP STACK AND FABRICATION METHOD | STARK, JARRETT J | — |
| 18664273 | MULTI-CHIP PACKAGE AND METHOD OF MAKING | STARK, JARRETT J | — |
| 18401329 | FAN-OUT STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE | AU, BAC H | — |
| Art Unit | Apps |
|---|---|
| 2818 | 1 |
| 2898 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18754081 | CHIP STACK AND FABRICATION METHOD | STARK, JARRETT J | — | §102§103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18664273 | MULTI-CHIP PACKAGE AND METHOD OF MAKING | STARK, JARRETT J | — | §102§103 | Non-Final OA | — | Pending | May 14, 2024 |
| 18401325 | STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE | KARIMY, TIMOR | 2818 | §102 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18401329 | FAN-OUT STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE | AU, BAC H | 2898 | §102§103 | Non-Final OA | — | Pending | Dec 29, 2023 |
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