Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18481404 | NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18373709 | INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18359000 | SEMICONDUCTOR DEVICE FABRICATION APPARATUS AND SEMICONDUCTOR DEVICE FABRICATION METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18343011 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18095147 | THREE-DIMENSIONAL NON-VOLATILE MEMORY DEVICE INCLUDING PERIPHERAL CIRCUITS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18188819 | RESISTIVE MEMORY DEVICE AND METHOD OF FORMING | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17956114 | SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS | Non-Final OA | International Business Machines Corporation |
| 17672750 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18190540 | COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18149712 | 3D SEMICONDUCTOR STRUCTURE FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18650641 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | Non-Final OA | SK hynix Inc. |
| 18148849 | SEMICONDUCTOR COMPONENTS, FABRICATION METHODS THEREOF AND MEMORY SYSTEMS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18089506 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18373357 | WIDE BANDGAP TRANSISTOR LAYOUT WITH DRAIN ON OUTER EDGE | Non-Final OA | SKYWORKS SOLUTIONS, INC. |
| 18463805 | MEMORY DIE STACK HAVING A SWITCH FOR SELECTIVELY CONNECTING A MEMORY DIE TO A SUBSTRATE | Non-Final OA | Sandisk Technologies, Inc. |
| 18451095 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18451060 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18177295 | MONOLITHIC DI-CHROMATIC DEVICE AND LIGHT EMITTING MODULE HAVING THE SAME | Non-Final OA | SEOUL VIOSYS CO., LTD |
| 18407222 | THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER | Final Rejection | Silicon Genesis Corporation |
| 17578873 | EMBEDDED TRANSISTOR DEVICES | Non-Final OA | X-Celeprint Limited |
| 18550433 | MODULE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | ULTRAMEMORY INC. |
| 18366396 | Semiconductor Device Package with Die Stackup and Connection Platform | Non-Final OA | Wester Digital Technologies, Inc. |
| 18343599 | WAFER LEVEL CHIP SCALE PACKAGE WITH RHOMBUS SHAPE | Final Rejection | Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd. |
| 18249941 | A MULTI-LAYERED STRUCTURE HAVING ANTIPAD FORMATIONS | Non-Final OA | BDCM A2 LLC |
| 18149985 | INTEGRATED CIRCUIT PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturiing Co., Ltd. |
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