Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18417847 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18481385 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18359000 | SEMICONDUCTOR DEVICE FABRICATION APPARATUS AND SEMICONDUCTOR DEVICE FABRICATION METHOD USING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18424902 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18558244 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18741382 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18527462 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18504046 | SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18501035 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., Ltd. |
| 18391023 | SINGLE DAMASCENE VIA PROFILES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Non-Final OA | Intel Corporation |
| 18374596 | MICROELECTRONIC ASSEMBLIES | Final Rejection | Intel Corporation |
| 18148849 | SEMICONDUCTOR COMPONENTS, FABRICATION METHODS THEREOF AND MEMORY SYSTEMS | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18650641 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | Final Rejection | SK hynix Inc. |
| 17974435 | LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL | Non-Final OA | Micron Technology, Inc. |
| 18401752 | INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18401789 | Power Switches in Interconnect Structures and the Method Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18498813 | MULTI-PARAMETER IMPLANTATION FOR MANAGING WAFER DISTORTION | Non-Final OA | Applied Materials, Inc. |
| 17672750 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18126127 | CHIRAL SPIN-CURRENT SUPPLY STRUCTURE FOR MTJ-BASED MEMORY | Non-Final OA | International Business Machines Corporation |
| 18188819 | RESISTIVE MEMORY DEVICE AND METHOD OF FORMING | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18451060 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUCTOR PACKAGE STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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