Listed by the USPTO as ANDERSON, WILLIAM H
Tech Center 3600 • Art Units: 2800 2817 3652
This examiner grants 85% of resolved cases
ANDERSON, WILLIAM H works in Tech Center 3600 and Art Unit 2800. The profile reports 225 resolved cases, an 84.9% allowance rate, and a median of 949 days to allowance. Interviews are associated with an 18.4% lift in the measured outcome.
The listed companies are Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and LG Display Co., Ltd. The listed firms are Harrity & Harrity, LLP, NORTH AMERICA INTELLECTUAL PROPERTY CORPORATION, and SEED INTELLECTUAL PROPERTY LAW GROUP LLP. The allowance figure can support a favorable initial assessment, while the median timing remains relevant to portfolio scheduling. Interviews may be useful when paired with a precise explanation of the claimed technology.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18675285 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18609921 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18224802 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18673715 | LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, AND WEARABLE DEVICE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18740114 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18608585 | DISPLAY DEVICE AND DISPLAY PANEL | Final Rejection | LG Display Co., Ltd. |
| 18417960 | DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF | Final Rejection | Samsung Display Co., LTD. |
| 18530892 | DISPLAY PANEL AND METHOD OF MANUFACTURING SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18705078 | LIGHT DETECTION APPARATUS AND ELECTRONIC APPARATUS | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18376597 | METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SUBSTRATE BY ATOMIC LAYER DEPOSITION AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | Final Rejection | ASM IP Holding B.V. |
| 18540542 | PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE | Non-Final OA | QUALCOMM Incorporated |
| 17934023 | CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE | Final Rejection | QUALCOMM Incorporated |
| 18762484 | POWER DELIVERY STRUCTURES | Non-Final OA | Intel Corporation |
| 17211751 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP | Non-Final OA | Intel Corporation |
| 18755180 | OPTIMIZED 3D INTEGRATED BACKSIDE POWER DELIVERY STRUCTURE | Non-Final OA | International Business Machines Corporation |
| 18589861 | TAPERED CHANNEL FORKSHEET TRANSISTOR | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17657961 | NANOSHEET PULL-UP TRANSISTOR IN SRAM | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18353110 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A WORD LINE WITH VARIABLE WIDTHS | Non-Final OA | SK hynix Inc. |
| 18491584 | METHODS AND APPARATUS FOR ANISOTROPIC FILM GROWTH, AND RELATED DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18626960 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18307002 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18506366 | IMMERSION COOLING SYSTEM AND METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18630807 | SEMICONDUCTOR DEVICE | Non-Final OA | TSMC NANJING COMPANY LIMITED |
| 18647764 | CIRCUIT BOARD AND ELECTRONIC DEVICE PACKAGE | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 17599532 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | Final Rejection | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy84.9% of resolved applications examined by William H Anderson were allowed (225 resolved cases), compared with 69.7% across Art Unit 2800 over the last five years.
This examiner's interview lift is +18.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by William H Anderson took 949 days on average from filing to allowance.
William H Anderson examines applications in Art Unit 2800 in Tech Center 3600 (Transportation, E-Commerce & Mechanical Systems).
