Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2691 2800 2833 2835 2841 2847 2848
This examiner grants 84% of resolved cases
Andargie M. Aychillhum is an examiner in Tech Center 2800 and Art Unit 2691. He has managed 1083 resolved cases with an allowance rate pct of 84.3%. This 84.3% rate indicates that a large majority of the applications in his portfolio result in a grant. The median days to allowance for these cases is 835, which establishes a timeline for practitioners to expect when prosecuting in this art unit. For the 1083 resolved cases, this 835-day period represents the median duration from filing to issuance for successful applications.
The data shows an interview lift pct of 14.7%. This 14.7% lift is an increase in the probability of allowance when an interview is conducted compared to the 84.3% baseline allowance rate. This suggests that direct communication with the examiner is a method for resolving outstanding rejections. Practitioners can use the 14.7% lift to evaluate the impact of an interview, as it correlates with a higher success rate than the baseline. The 835-day median suggests that the process in Art Unit 2691 is relatively efficient for the 1083 resolved cases.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18901903 | ELECTRONIC DEVICE INCLUDING FLEXIBLE DISPLAY | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18826856 | ELECTRONIC DEVICE INCLUDING A PLURALITY OF FLEXIBLE PRINTED CIRCUIT BOARDS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 19016774 | SYSTEMS AND METHODS FOR HIGH-STIFFNESS SUBSTRATE INTEGRATION IN SEMICONDUCTOR PACKAGES | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18155995 | HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18973212 | Embeddable Electrically Insulating Thermal Connector and Circuit Board Including the Same | Non-Final OA | KYOCERA AVX Components Corporation |
| 18983966 | PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME | Non-Final OA | LG INNOTEK CO., LTD. |
| 18865493 | CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME | Non-Final OA | LG INNOTEK CO., LTD. |
| 18956455 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18678325 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18585618 | CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18562074 | DEGRADABLE SUBSTRATE FOR ELECTRONIC DEVICE, DEGRADABLE SUBSTRATE ASSEMBLY FOR ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING DEGRADABLE SUBSTRATE FOR ELECTRONIC DEVICE | Final Rejection | KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| 18692075 | Manufacturing a Component Carrier by a Nano Imprint Lithography Process | Final Rejection | AT&S Austria Technologie & Systemtechnik AG |
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