Tech Center 2800 • Art Units: 2835 2841 2847 2848
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18705669 | CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY | Non-Final OA | Telefonaktiebolaget LM Ericsson (publ) |
| 17851957 | INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER | Final Rejection | Intel Corporation |
| 17831774 | CIRCUIT BOARD TO REDUCE FAR END CROSS TALK | Non-Final OA | Intel Corporation |
| 18678325 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18657425 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18747474 | POWER SUPPLY DEVICE AND POWER SUPPLY UNIT | Non-Final OA | GIGA-BYTE TECHNOLOGY CO.,LTD. |
| 18180502 | PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF | Non-Final OA | AaltoSemi Inc. |
| 18504408 | CREATING A SOLDER BARRIER BY CHANGING A MATERIAL PROPERTY OF A TRACE ON A PRINTED CIRCUIT BOARD | Non-Final OA | Sandsik Technologies, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy