Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2691 2835 2841 2847 2848
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17899336 | TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES | Non-Final OA | Intel Corporation |
| 17831774 | CIRCUIT BOARD TO REDUCE FAR END CROSS TALK | Non-Final OA | Intel Corporation |
| 18678325 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18585618 | CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18692075 | Manufacturing a Component Carrier by a Nano Imprint Lithography Process | Non-Final OA | AT&S Austria Technologie & Systemtechnik AG |
| 18418125 | PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18504408 | CREATING A SOLDER BARRIER BY CHANGING A MATERIAL PROPERTY OF A TRACE ON A PRINTED CIRCUIT BOARD | Non-Final OA | Sandsik Technologies, Inc. |
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