Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18226037 | SEMICONDUCTOR DEVICE INCLUDING COMMON BODY BIAS REGION | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18212422 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18335492 | VERTICAL NONVOLATILE MEMORY DEVICE INCLUDING MEMORY CELL STRINGS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18321275 | SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18136993 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18132198 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18575971 | DISPLAY APPARATUS, DISPLAY MODULE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING DISPLAY APPARATUS | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18470664 | BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18533229 | ELECTRONIC APPARATUSES AND MANUFACTURING METHODS THEREOF | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18362316 | SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18381706 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18339681 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18060347 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18499088 | SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND RECESSED MULTI-STEP FIELD PLATE AND METHOD OF FABRICATION THEREFOR | Non-Final OA | NXP USA, Inc. |
| 18533354 | TRENCH GATE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | MIRISE Technologies Corporation |
| 18309768 | ELECTRONIC PACKAGE | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18378312 | HIGH ELECTRON MOBILITY TRANSISTOR | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18285389 | ANODIC ALUMINUM OXIDE FILM-BASED INTERPOSER FOR ELECTRICAL CONNECTION AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR, MULTI-STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, DISPLAY AND MANUFACTURING METHOD THEREFOR | Non-Final OA | POINT ENGINEERING CO., LTD. |
| 18570666 | METHOD FOR MANUFACTUING NON-EMITTING III-NITRIDE SEMICONDUCTOR STACKED STRUCTURE | Non-Final OA | WAVELORD CO., LTD |
| 18343298 | METHOD FOR MANUFACTURING HIGH-VOLTAGE TRANSISTORS ON A SILICON-ON-INSULATOR TYPE BULK | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18561231 | PLATINUM GROUP METAL CHALCOGENIDE THIN FILM, AND SEMICONDUCTOR MATERIAL PROVIDED WITH THE PLATINUM GROUP METAL CHALCOGENIDE THIN FILM | Final Rejection | UNIVERSITY INDUSTRY FOUNDATION, YONSEI UNIVERSITY |
| 18198297 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Fujian Jinhua Integrated Circuit Co., Ltd. |
| 18374205 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
| 18174418 | INTEGRATED CIRCUIT CHIP WITH 2D FIELD-EFFECT TRANSISTORS AND ON-CHIP THIN FILM LAYER DEPOSITION WITH ELECTRICAL CHARACTERIZATION | Non-Final OA | Cardea Bio, Inc. |
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