Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18499446 | MEMORY DEVICE WITH INTERPLANE PAD PART | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18382395 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18212422 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18335492 | VERTICAL NONVOLATILE MEMORY DEVICE INCLUDING MEMORY CELL STRINGS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18315098 | Semiconductor Device and Method of Making a Fan-Out Semiconductor Package with Pre-Assembled Passive Modules | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18391137 | PASS-THROUGH STRUCTURES | Non-Final OA | QUALCOMM Incorporated |
| 18249415 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18579259 | SEMICONDUCTOR-SUPERCONDUCTOR HYBRID DEVICE INCLUDING AN ELECTRODE ARRAY | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18392536 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18658367 | Memory Cells and Integrated Assemblies having Charge-Trapping-Material with Trap-Enhancing-Additive | Non-Final OA | Micron Technology, Inc. |
| 18411041 | SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18381706 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18347542 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18544114 | HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE | Non-Final OA | International Business Machines Corporation |
| 18533229 | ELECTRONIC APPARATUSES AND MANUFACTURING METHODS THEREOF | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18833290 | OPTOELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18396378 | REPACKAGING STRUCTURE | Non-Final OA | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 18508551 | SCALABLE POWER SEMICONDUCTOR DEVICE PACKAGE WITH LOW INDUCTANCE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18411028 | SEMICONDUCTOR DEVICE | Non-Final OA | IDEMITSU KOSAN CO., LTD. |
| 18309768 | ELECTRONIC PACKAGE | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18508322 | SPLIT SUPPORT SHIELD STRUCTURES FOR TRENCHED SEMICONDUCTOR DEVICES WITH INTEGRATED SCHOTTKY DIODES | Non-Final OA | Wolfspeed, Inc. |
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