Tech Center 2800 • Art Units: 2897
This examiner grants 96% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18390772 | PACKAGE WITH LOW-WARPAGE CARRIER | Non-Final OA | Infineon Technologies AG |
| 18566779 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 18513439 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18396922 | DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS | Non-Final OA | Intel Corporation |
| 18090883 | PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES | Non-Final OA | Intel Corporation |
| 18148147 | VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL | Non-Final OA | Intel Corporation |
| 18069507 | METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES | Non-Final OA | Intel Corporation |
| 18502084 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18365049 | SEMICONDUCTOR APPARATUS, FABRICATION METHOD THEREOF AND MEMORY SYSTEM | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18526828 | CONTACT AIR GAP FORMATION AND STRUCTURES THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18526397 | TRANSISTOR ISOLATION REGIONS AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18302948 | NFET and PFET with Different Fin Numbers in FinFET Based CFET | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18386159 | MOSFET TRANSISTOR | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18379053 | HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME | Non-Final OA | Adeia Semiconductor Bonding Technologies, Inc. |
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