Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2897
This examiner grants 96% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18396922 | DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS | Non-Final OA | Intel Corporation |
| 18090883 | PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES | Non-Final OA | Intel Corporation |
| 18148147 | VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL | Non-Final OA | Intel Corporation |
| 18069507 | METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES | Non-Final OA | Intel Corporation |
| 18526986 | MULTI-GATE SWITCH FIELD EFFECT TRANSISTOR | Non-Final OA | Wolfspeed, Inc. |
| 18379053 | HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME | Non-Final OA | Adeia Semiconductor Bonding Technologies, Inc. |
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