Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1743 1748 1759 1763
This examiner grants 60% of resolved cases
Wenwen Cai is an examiner in Tech Center 1700 and Art Unit 1743. She has a high volume of 878 resolved cases. Her allowance rate is 59.8 percent. This 59.8 percent rate indicates the frequency with which applications result in a patent grant under her supervision in Art Unit 1743.
The interview lift for this examiner is 19.4 percent. This 19.4 percent lift suggests that interviews are a productive way to advance prosecution and increase the chances of a grant. For the 878 resolved cases, practitioners should consider the 19.4 percent lift as a tool for resolving rejections and moving the case toward a final grant.
The median days to allowance is 1163. This 1163 day figure represents the typical timeframe for an application to reach a successful conclusion. The 1163 day median indicates the pace of prosecution in Tech Center 1700. Applicants can use the 59.8 percent allowance rate and the 1163 day median to manage their patent portfolios effectively.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18050371 | QUANTUM DOT-CONTAINING POLYMERIZABLE COMPOSITION, CURED PRODUCT, WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, AND LIQUID CRYSTAL DISPLAY DEVICE | Final Rejection | FUJIFILM Corporation |
| 18682376 | POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME | Non-Final OA | LG CHEM, LTD. |
| 17798465 | LIGHT STABILIZER MIXTURE | Non-Final OA | BASF SE |
| 18225349 | CYANOACRYLATE COMPOSITIONS | Non-Final OA | Henkel AG & Co. KGaA |
| 18033950 | CURABLE COMPOSITION AND SEALANT | Final Rejection | KURARAY CO., LTD. |
| 18426404 | REHEALABLE AND REWORKABLE ELECTRONIC PACKAGING MATERIALS | Non-Final OA | International Business Machines Corporation |
| 18294588 | Polycarbonate Compositions Having a High CTI | Non-Final OA | Covestro Deutschland AG |
| 18485454 | AUTONOMOUS SELF-HEALABLE AND MECHANICALLY ROBUST HYDROGEL AND TRIBOELECTRIC NANOGENERATOR COMPRISING THE SAME | Non-Final OA | City University of Hong Kong |
| 18399943 | CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALING MATERIAL | Non-Final OA | AGC Inc. |
| 18062617 | POWDER COATING MATERIAL COMPOSITION AND LAMINATE | Final Rejection | AGC INC. |
| 18572066 | USE OF MULTIBLOCK COPOLYMERS AS SACRIFICIAL MATERIAL IN A 3D PRINTING PROCESS | Non-Final OA | Arkema France |
| 18032844 | ACTINICALLY CURABLE COMPOSITIONS FOR ABLATIVE CARBON-BONDED COMPOSITES AND ADDITIVE MANUFACTURING METHOD USING SUCH COMPOSITIONS | Non-Final OA | Arkema France |
| 18415760 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER BODY, SHEET CURED PRODUCT, AND CIRCUIT BOARD MATERIAL | Non-Final OA | Mitsubishi Chemical Corporation |
| 18528627 | Methyl Methacrylate-Containing Composition, Storage Method for Methyl Methacrylate-Containing Composition, and Production Method for Methyl Methacrylate Polymer | Non-Final OA | Mitsubishi Chemical Corporation |
| 17988095 | ETHYLENE-VINYL ALCOHOL COPOLYMER RESIN COMPOSITION, MULTILAYER STRUCTURE, AND PACKAGE | Non-Final OA | MITSUBISHI CHEMICAL CORPORATION |
| 18430964 | WATER-DISPERSED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR RE-PEELING | Non-Final OA | NITTO DENKO CORPORATION |
| 18577915 | CURABLE RESIN COMPOSITION AND CURED PRODUCT | Non-Final OA | DIC CORPORATION |
| 18563712 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT | Non-Final OA | THREEBOND CO., LTD. |
| 18642109 | FIBER REINFORCED POLYPROPYLENE COMPOSITE | Non-Final OA | BOREALIS AG |
| 16751592 | POLYOLEFIN COMPOSITION FOR ENHANCED LASER PRINTING | Non-Final OA | BOREALIS AG |
| 18551657 | Water-based Polymeric Colorant Inks for Cellulosic Substrates | Non-Final OA | Sun Chemical Corporation |
| 17473456 | WOOD STAINS AND PENETRATION PRIMERS COMPRISING LOW VOC LEVEL AQUEOUS DISPERSIONS | Non-Final OA | Celanese International Corporation |
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