Listed by the USPTO as ENAD, CHRISTINE A
Tech Center 2800 • Art Units: 2811 2823
This examiner grants 84% of resolved cases
ENAD, CHRISTINE A examines in tech center 2800 and art unit 2811. The profile includes 1367 resolved cases and an allowance rate of 84.5%. The median time to allowance is 729 days. The high allowance rate and comparatively shorter recorded timeline provide a favorable prosecution profile for practitioners evaluating expected examination dynamics.
The interview lift is 10.2%, reflecting a modest positive association between interviews and allowance outcomes. Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, and Innolux Corporation are the top companies. The listed firms are BIRCH STEWART KOLASCH & BIRCH, LLP, Alliance IP, LLC - Intel, and Arcane Law PLLC. These participants provide useful context for portfolio work, while the individual application remains the controlling basis for strategy.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18651878 | SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING SYSTEM | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18888991 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18834371 | TWO-DIMENSIONAL ELECTRON GAS FIELD-EFFECT TRANSISTOR HAVING SIDE GATES | Non-Final OA | CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE |
| 18472074 | TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL | Non-Final OA | QUALCOMM Incorporated |
| 18129651 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING MULTI-LAYER MOLYBDENUM METAL GATE STACK | Final Rejection | Intel Corporation |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | Final Rejection | Intel Corporation |
| 17856969 | SUBSTRATES WITH NITRIDED GLASS CORES | Final Rejection | Intel Corporation |
| 18813003 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18644445 | SENSING DEVICE | Non-Final OA | InnoLux Corporation |
| 18694600 | DEPOSITION AND TREATMENT OF NANO-GRAPHENE AT LOW TEMPERATURES | Final Rejection | Lam Research Corporation |
| 18610150 | SEMICONDUCTOR DEVICE WITH SLANTED FIELD PLATE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18458280 | SEMICONDUCTOR DEVICE HAVING A REDUCED HEIGHT GATE ELECTRODE LAYER | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18700432 | VIAS INCLUDING A POROUS ELECTRICALLY CONDUCTIVE MATERIAL AND METHODS FOR FABRICATING THE VIAS | Non-Final OA | CORNING INCORPORATED |
| 18529029 | STACKED TRANSISTORS HAVING DUAL WORK FUNCTION GATES | Non-Final OA | International Business Machines Corporation |
| 17950293 | BACKSIDE SIGNAL INTEGRATION THROUGH VIA TO SIGNAL LINE CONNECTION | Non-Final OA | International Business Machines Corporation |
| 17847679 | PROCESS FOR MANUFACTURING A VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE AND VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE | Non-Final OA | STMicroelectronics S.r.l. |
| 18589527 | DAMAGE PREVENTION DURING WAFER EDGE TRIMMING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18464839 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18227731 | CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18348064 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18162714 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18471739 | Integrated Circuit Packages and Methods of Forming the Same | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17896970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18545601 | HYBRID THERMAL INTERFACE MATERIAL WITH EMBEDDED METAL LAYER | Final Rejection | Sandisk Technologies, Inc. |
| 18663651 | LIGHT-EMITTING DEVICE, PLANAR LIGHT SOURCE, AND LIQUID CRYSTAL DISPLAY DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18584075 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18255516 | METALLIZATION OF SEMICONDUCTOR WAFER | Non-Final OA | Heraeus Deutschland GmbH & Co. KG |
| 18405172 | SEMICONDUCTOR PACKAGE STRUCTURE | Final Rejection | MediaTek Singapore Pte. Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy84.5% of resolved applications examined by Christine A Enad were allowed (1,367 resolved cases), compared with 72.2% across Art Unit 2811 over the last five years.
This examiner's interview lift is +10.2 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Christine A Enad took 729 days on average from filing to allowance.
Christine A Enad examines applications in Art Unit 2811 in Tech Center 2800 (Semiconductors, Circuits & Optics).
