Listed by the USPTO as ERDEM, FAZLI
Tech Center 2800 • Art Units: 2811 2812 2826
This examiner grants 86% of resolved cases
ERDEM, FAZLI examines in tech center 2800 and art unit 2811. The profile covers 1092 resolved cases, with an allowance rate of 85.5%. The median time to allowance is 896 days. The high allowance rate is supported by a substantial case record, while the median timeline provides a meaningful reference for portfolio planning.
The interview lift is 15.7%, indicating a positive association between interviews and allowance outcomes. Samsung Electronics Co., Ltd., Intel Corporation, and Qualcomm Incorporated are the listed top companies. The top firms are Alliance IP, LLC - Intel, BIRCH STEWART KOLASCH & BIRCH, LLP, and CANTOR COLBURN LLP. The profile may support early consideration of examiner interviews alongside targeted claim amendments and careful prosecution records.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18748354 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18670777 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18505279 | SEMICONDUCTOR DEVICES | Final Rejection | Samsung Electronics Co., Ltd. |
| 18887225 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18713939 | LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS | Final Rejection | Sony Semiconductor Solutions Corporation |
| 18697127 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18734056 | PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18538738 | INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER | Non-Final OA | QUALCOMM Incorporated |
| 18362831 | WAFFLE-SHAPED RADIO FREQUENCY (RF) SWITCH | Non-Final OA | QUALCOMM Incorporated |
| 18346087 | HIGH CONDUCTIVITY TRANSISTOR CONTACTS COMPRISING GALLIUM ENRICHED LAYER | Non-Final OA | Intel Corporation |
| 18141887 | NITRIDE ETCH FOR CONSISTENT STEP HEIGHT FOR TSV REVEAL IN THE VIA MID FLOW | Final Rejection | Intel Corporation |
| 18621738 | METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED MICROELECTRONIC DEVICES | Non-Final OA | Micron Technology, Inc. |
| 18529069 | ENLARGED BACKSIDE CONTACT THROUGH STI LINER RECESS | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18889962 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18754948 | SEMICONDUCTOR INTEGRATED CIRCUIT | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18673165 | PACKAGE WITH VERTICALLY STACKED DEVICES, AND FABRICATION METHODS THEREOF | Non-Final OA | Qorvo US, Inc. |
| 18660776 | INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUITS FOR HEAT SPREADING | Non-Final OA | Qorvo US, Inc. |
| 18645851 | MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS | Final Rejection | Qorvo US, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy85.5% of resolved applications examined by Fazli Erdem were allowed (1,092 resolved cases), compared with 72.2% across Art Unit 2811 over the last five years.
This examiner's interview lift is +15.7 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Fazli Erdem took 896 days on average from filing to allowance.
Fazli Erdem examines applications in Art Unit 2811 in Tech Center 2800 (Semiconductors, Circuits & Optics).
