Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2891 2899
This examiner grants 83% of resolved cases
Peniel M. Gumedzoe serves in Tech Center 2800 and Art Unit 2891. The profile includes 1331 resolved cases, which show an allowance rate of 83.2 percent. This 83.2 percent rate provides a baseline for practitioners to estimate the probability of a grant. With 1331 resolved cases, the data provides a statistically significant look at the examiner's tendencies in this semiconductor and electronic component center.
The data shows an interview lift of 3.6 percent. This figure indicates that conducting an interview is associated with a slightly increased probability of allowance compared to the baseline of cases where no interview occurs. Practitioners may consider the 3.6 percent lift when deciding whether to engage in direct communication. This metric suggests that verbal advocacy provides a modest benefit in the prosecution process for Art Unit 2891.
The median days to allowance for Gumedzoe is 804. This 804-day timeline provides a benchmark for the expected duration of the prosecution process from filing to grant. The combination of the 83.2 percent allowance rate and the 3.6 percent interview lift offers a roadmap for applicants. Understanding these metrics, including the 804-day median, helps in setting expectations for both timing and results in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18730284 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18699022 | LIGHT DEFLECTING DEVICE AND DISTANCE MEASURING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18578324 | IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18649297 | HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION | Non-Final OA | Micron Technology, Inc. |
| 18673328 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18671330 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18783905 | SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18775879 | HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18663038 | DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18613172 | SEMICONDUCTOR DIES HAVING ELECTRICAL ISOLATION LAYERS AND METHODS OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18651653 | ELECTRONIC PACKAGE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18257975 | LIGHT-EMITTING DIODE PACKAGE | Final Rejection | SEOUL VIOSYS CO., LTD. |
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