Tech Center 3700 • Art Units: 3613 3744 3763
This examiner grants 60% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18099522 | HEAT-DISSIPATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE HEAT-DISSIPATING STRUCTURE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 19301855 | Hybrid Dry Adiabatic Cooling Chilled Water Plant for Data Centers and Other IT Environments | Non-Final OA | Shumate Engineering, PLLC |
| 18343893 | HEAT RADIATING MEMBER AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18422847 | Liquid Cooling Plate, Liquid Cooling System, and Electronic Device | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18359937 | HEAT DISSIPATION APPARATUS, HEAT DISSIPATION APPARATUS PREPARATION METHOD, AND WIRELESS COMMUNICATION BASE STATION | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18822736 | Work Vehicle | Non-Final OA | Kubota Corporation |
| 16665893 | AIRCRAFT SYSTEMS AND RELATED METHODS | Final Rejection | The Boeing Company |
| 18661636 | METAL FOAM THERMAL INTERFACE MATERIALS | Non-Final OA | International Business Machines Corporation |
| 18823364 | COOLING ASSEMBLY FOR HIGH POWER DENSITY COMPUTER RACKS | Non-Final OA | VERTIV CORPORATION |
| 18605003 | HELICAL PILE WITH HEAT EXCHANGER | Non-Final OA | Hubbell Incorporated |
| 18780518 | COLD PLATE AND METHOD OF MANUFACTURING COLD PLATE | Final Rejection | FURUKAWA ELECTRIC CO., LTD. |
| 18611652 | APPARATUSES AND METHODS FOR LIQUID COOLING A VEHICLE WHEEL CONTROLLER | Non-Final OA | HL MANDO CORPORATION |
| 18334494 | AIRCRAFT AND ASSOCIATED METHOD OF CONDITIONING CABIN AIR | Non-Final OA | PRATT & WHITNEY CANADA CORP. |
| 18814204 | HEAT EXCHANGER CORE LAYER PIN | Non-Final OA | Hamilton Sundstrand Corporation |
| 18438907 | INTERWOVEN HEAT EXCHANGER CORE WITH END FACE FEATURES | Final Rejection | Hamilton Sundstrand Corporation |
| 18563541 | HEAT CONDUCTION FILM AND HEAT-DISSIPATING STRUCTURE USING SAME | Final Rejection | NISSAN MOTOR CO., LTD. |
| 18461563 | COOLING DEVICE FOR SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 19083251 | SEALING SYSTEM AND METHOD | Non-Final OA | ERWIN QUARDER SYSTEMTECHNIK GMBH |
| 17654625 | TEMPERATURE CONTROL UNIT AND PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18841696 | PLATE CONSTITUTING A HEAT EXCHANGER AND HEAT EXCHANGER COMPRISING AT LEAST ONE SUCH PLATE | Non-Final OA | VALEO SYSTEMES THERMIQUES |
| 18722036 | HEAT EXCHANGER | Non-Final OA | Hanon Systems |
| 18367128 | THERMAL CONTROL SYSTEM | Final Rejection | Stryker Corporation |
| 18710627 | FLUID MANAGEMENT APPARATUS AND THERMAL MANAGEMENT SYSTEM | Non-Final OA | ZHEJIANG SANHUA AUTOMOTIVE COMPONENTS CO., LTD. |
| 17916782 | HEAT EXCHANGING APPARATUS AND MANUFACTURING METHOD THEREFOR | Final Rejection | ZHEJIANG SANHUA AUTOMOTIVE COMPONENTS CO., LTD. |
| 18579974 | WORK MACHINE AND CONTROL METHOD FOR WORK MACHINE | Non-Final OA | KOMATSU LTD. |
| 18441042 | PLANAR ASSEMBLY HANDLE FOR HEAT SINK OPTIMIZATION | Non-Final OA | Dell Products L.P. |
| 18665311 | DATA CENTER COOLING DISTRIBUTION UNITS WITH REPLACEABLE COMPONENTS | Non-Final OA | NVIDIA Corporation |
| 18099189 | ARRANGEMENT FOR HEAT EXCHANGER | Final Rejection | Johnson Controls Tyco IP Holdings LLP |
| 17956802 | SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING | Final Rejection | ADVANCED MICRO DEVICES, INC. |
| 18666113 | Apparatus and method for heating process media in a fiber molding process | Non-Final OA | Kiefel GmbH |
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