Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2823 2894
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19351203 | METHODS OF FABRICATING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS AND MEMORY CELLS | Non-Final OA | Monolithic 3D Inc. |
| 19351167 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH TRANSISTORS, METAL LAYERS, AND SINGLE CRYSTAL TRANSISTOR CHANNELS | Non-Final OA | Monolithic 3D Inc. |
| 18554921 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18284068 | POWER SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18325291 | METHOD OF MANUFACTURING QUANTUM DOT-CONTAINING COMPLEX, QUANTUM DOT-CONTAINING COMPLEX MANUFACTURED THEREBY, LIGHT-EMITTING DEVICE INCLUDING QUANTUM DOT-CONTAINING COMPLEX AND ELECTRONIC APPARATUS INCLUDING QUANTUM DOT-CONTAINING COMPLEX | Non-Final OA | Samsung Display Co., Ltd. |
| 18148687 | METAL-ON-METAL DEPOSITION METHODS FOR FILLING A GAP FEATURE ON A SUBSTRATE SURFACE | Non-Final OA | ASM IP Holding B.V. |
| 18147038 | SYSTEMS AND METHODS FOR CLEANING AND TREATING A SURFACE OF A SUBSTRATE | Non-Final OA | ASM IP Holding B.V. |
| 18554660 | DISPLAY DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18037638 | OXIDE SEMICONDUCTOR HAVING OHMIC JUNCTION STRUCTURE, THIN-FILM TRANSISTOR HAVING SAME, AND MANUFACTURING METHODS THEREFOR | Non-Final OA | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| 18283897 | POWER SEMICONDUCTOR MODULE COMPRISING SWITCH ELEMENTS AND DIODES | Non-Final OA | Hitachi Energy Ltd |
| 18041391 | COMBINED SELF-FORMING BARRIER AND SEED LAYER BY ATOMIC LAYER DEPOSITION | Non-Final OA | Lam Research Corporation |
| 18283972 | METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEANS OF SINTERING | Non-Final OA | SAFRAN ELECTRONICS & DEFENSE |
| 18384396 | PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUTTERING TARGET MAKING THE SAME, SEMICONDUCTOR BONDING STRUCTURE AND SEMICONDUCTOR BONDING PROCESS | Non-Final OA | SOLAR APPLIED MATERIALS TECHNOLOGY CORP. |
| 18554788 | A diode radiation sensor | Non-Final OA | Fondazione Bruno Kessler |
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