Tech Center 2800 • Art Units: 2825 2851
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18209434 | THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS | Non-Final OA | Intel Corporation |
| 18478469 | RUNTIME OPTIMIZATION OF ACTIVE INTERPOSER DIES FROM DIFFERENCE PROCESS BINS | Non-Final OA | Advanced Micro Devices, Inc. |
| 18217339 | INTERPOSER STITCH THROUGH A TOP CHIPLET | Non-Final OA | XILINX, INC. |
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