Tech Center 3700 • Art Units: 3744 3763
This examiner grants 54% of resolved cases
For K. Ling is an examiner in Tech Center 3700, specifically Art Unit 3744. The examiner has 456 resolved cases. The allowance rate is 53.7 percent. This rate indicates that just over half of the applications reaching a final disposition are granted. Practitioners should be prepared for a balanced examination process where success requires clear and persuasive arguments.
The median days to allowance is 1232. This duration represents the typical time from filing to the issuance of a patent. The interview lift is 18.6 percent. This figure shows the increased chance of allowance when an interview is conducted. Compared to the 53.7 percent allowance rate, the 18.6 percent lift suggests that direct engagement with the examiner is a productive way to advance prosecution.
With 456 resolved cases, Ling's profile provides a reliable view of prosecution in Art Unit 3744. The 1232 median days to allowance is a key factor for managing expectations. The 18.6 percent interview lift is a valuable tool for overcoming rejections. Overall, the 53.7 percent allowance rate reflects an environment where proactive communication can significantly improve the chances of a grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18649180 | HEAT EXCHANGER HAVING A MIXING CHAMBER WITH CONVERGENT SECTION | Non-Final OA | PRATT & WHITNEY CANADA CORP. |
| 18384373 | HEAT EXCHANGER | Final Rejection | MAHLE International GmbH |
| 19107220 | MOTOR SUPPORT AND MOTORISED FAN UNIT FOR A HEATING, VENTILATION AND/OR AIR-CONDITIONING SYSTEM OF A CORRESPONDING VEHICLE, IN PARTICULAR A MOTOR VEHICLE | Final Rejection | VALEO SYSTEMES THERMIQUES |
| 18701928 | SUPPORT COMPONENT AND HEAT EXCHANGER SUPPORT OBTAINED FROM AN ASSEMBLY OF SUCH SUPPORT COMPONENTS | Final Rejection | VALEO SYSTEMES THERMIQUES |
| 19082983 | COOLING CONFIGURATION FOR MEMORY DEVICE AND RELATED COMPUTER SYSTEM | Non-Final OA | Intel Corporation |
| 17560070 | HEAT PIPE WITH FIRST HEAT SOURCE ON FIRST SIDE AND SECOND HEAT SOURCE ON OPPOSITE SECOND SIDE | Non-Final OA | Intel Corporation |
| 19105568 | Heat Sink Assembly | Non-Final OA | LG Energy Solution, Ltd. |
| 18883164 | LIQUID COOLING DEVICE | Final Rejection | Delta Electronics, Inc. |
| 18482454 | THREE-WAY HEAT EXCHANGE MODULE HAVING UNIFORM FLUID DISTRIBUTION | Non-Final OA | Copeland LP |
| 18750988 | GAS HUMIDITY REDUCTION APPARATUS AND METHOD OF USING THE SAME | Non-Final OA | Honeywell International Inc. |
| 18597845 | VAPOR CHAMBER AND METHOD OF PRODUCING THE SAME | Final Rejection | KMW INC. |
| 18028189 | CONDENSER ARRANGEMENT FOR HVAC SYSTEM | Final Rejection | JOHNSON CONTROLS TYCO IP HOLDINGS LLP |
| 17886206 | HEAT EXCHANGER FOR HVAC SYSTEM | Non-Final OA | Johnson Controls Tyco IP Holdings LLP |
| 18126852 | HEAT TRANSFER FLUID FOR THERMAL MANAGEMENT, THERMAL MANAGEMENT DEVICE AND BATTERY THERMAL MANAGEMENT SYSTEM | Non-Final OA | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 18740077 | CONDENSATE MANAGEMENT SYSTEM FOR AN AIR CONDITIONER APPLIANCE | Non-Final OA | Haier US Appliance Solutions, Inc. |
| 18704251 | PAIR OF HEAT-EXCHANGER PLATES WITH GROOVES AND RECESSES | Non-Final OA | AXENS |
| 18158823 | MICROCHANNEL COMPACT HEAT EXCHANGING SYSTEM | Final Rejection | King Abdulaziz University |
| 18777781 | COMBINED HEAT DISSIPATION STRUCTURE | Non-Final OA | ASIA VITAL COMPONENTS CO., LTD. |
| 16833616 | GRAPHITIC FILM-ENABLED BATTERY COOLING SYSTEM AND METHOD OF OPERATING SAME | Final Rejection | Global Graphene Group, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy