Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2483 2812 2823 2829 2893
This examiner grants 91% of resolved cases
Michelle Mandala is an examiner in Tech Center 2800 and Art Unit 2483. She has managed 1015 resolved cases, which provides the basis for her performance metrics. The overall allowance rate is 91.0 percent. This 91.0 percent figure serves as a baseline for applicants to evaluate their chances of success. Practitioners can use the 1015 case history to assess the examiner's experience level in this specific field.
The data highlights a 7.9 percent interview lift, suggesting that direct communication can influence the outcome of a case. This 7.9 percent lift is a key tactical consideration for those deciding whether to request a formal discussion. The median days to allowance for her cases is 806. This 806 day period reflects the typical timeframe from filing to patent issuance for successful applications. Understanding the 806 day median pendency and the impact of interviews can help practitioners develop a more efficient prosecution strategy for Art Unit 2483 and Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18634355 | SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18611448 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18073371 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | LG DISPLAY CO., LTD. |
| 18722538 | ELECTRONIC/OPTICAL DEVICE AND MANUFACTURING METHOD THEREFOR | Non-Final OA | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
| 18121331 | VIA STRUCTURES IN BONDED GLASS SUBSTRATES | Non-Final OA | Intel Corporation |
| 18655509 | ENCAPSULATING A PORTION OF A THROUGH-SILICON-VIA | Non-Final OA | International Business Machines Corporation |
| 18611797 | INTEGRATED CIRCUIT CHIP HAVING VIA TOWERS FOR POWER CONNECTION AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18786788 | INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18789786 | SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 17974385 | PIXEL DEFINING ENCAPSULATING BARRIER FOR RGB COLOR PATTERNING | Non-Final OA | Applied Materials, Inc. |
| 18613801 | MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18645076 | MOLDED PACKAGE WITH INTERCONNECT POSTS WITH PLATED SOLDER CAPS | Non-Final OA | Skyworks Solutions, Inc. |
| 18717984 | BROADBAND SILICON SENSOR | Non-Final OA | SRI International |
| 18424400 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME | Final Rejection | Winbond Electronics Corp. |
| 18576759 | Bonding Structure | Non-Final OA | Teknologian tutkimuskeskus VTT Oy |
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