Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1717 1746 1785 2891 3635 3724
This examiner grants 74% of resolved cases
Abhishek A. Patwardhan works within Tech Center 3700 and Art Unit 1717. He has managed 261 resolved cases, resulting in an allowance rate of 73.9%. This rate indicates that a majority of the applications he reviews are granted. The median days to allowance for these successful cases is 937. Additionally, the data shows an interview lift of 13.1%.
This positive lift suggests that conducting an interview with the examiner is associated with an increased probability of securing an allowance. Practitioners should consider this 13.1% lift when deciding whether to engage in direct communication. With 261 resolved cases, the data is statistically significant and provides a reliable basis for planning. The 73.9% allowance rate and 937 days to allowance suggest a steady path to grant for applicants in Art Unit 1717. Strategic use of interviews can further enhance the likelihood of a positive outcome for those seeking to secure intellectual property rights.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18849820 | ADHESIVE CONTAINING POLYETHER-MODIFIED SILOXANE | Final Rejection | NISSAN CHEMICAL CORPORATION |
| 19026515 | FILLET SHAPING DIE AND BONDING METHOD | Non-Final OA | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18786165 | SOLVATED ADHESIVE COMPOSITION AND METHOD | Final Rejection | Eaton Intelligent Power Limited |
| 18182383 | PRESSING APPARATUS AND PRESSING METHOD | Final Rejection | HONDA MOTOR CO., LTD. |
| 18402080 | Device and Method for Manufacturing an Electrode | Non-Final OA | Volkswagen Aktiengesellschaft |
| 18488546 | FREE-FORM DISPENSING AND LAMINATION | Non-Final OA | Henkel AG & Co. KGaA |
| 18595341 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 19010575 | BONDING METHOD AND BONDING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18293847 | EXPANDABLE ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION | Non-Final OA | SIKA TECHNOLOGY AG |
| 18429574 | ADHESIVE AND ADHERING METHOD | Non-Final OA | DISCO CORPORATION |
| 18655351 | COPPER FOIL COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | NAN YA PLASTICS CORPORATION |
| 18830311 | SYSTEMS AND METHODS FOR ADHESIVE-BASED PART RETENTION FEATURES IN ADDITIVELY MANUFACTURED STRUCTURES | Non-Final OA | Divergent Technologies, Inc. |
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