Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2813 2819 2894
This examiner grants 85% of resolved cases
Thanhha S Pham has a record of 891 resolved cases in Tech Center 2800 and Art Unit 2812. The allowance rate is 85.4 percent, which is quite high and indicates a favorable environment for patent applicants in the semiconductor arts. This 85.4 percent rate suggests that the vast majority of applications reach a grant. The 891 resolved cases provide a statistically significant basis for these performance metrics. Practitioners can expect a predictable and generally receptive prosecution environment.
The interview lift is 4.8 percent, representing a modest benefit from direct communication with the examiner. While the 85.4 percent allowance rate is already high, an interview may still assist in resolving specific technical hurdles. The median days to allowance is 842, showing a reasonably efficient prosecution cycle for this technology area. Practitioners should use this 842-day figure to manage client expectations regarding the duration of the examination. The combination of an 85.4 percent allowance rate and a 4.8 percent interview lift supports a standard prosecution strategy.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18665718 | NITRIDE STRUCTURE AND SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18622845 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Huawei Digital Power Technologies Co., Ltd. |
| 18644640 | POWER MODULE HAVING COVER CONTACT ELEMENT AND SINTERED CONNECTION | Non-Final OA | Robert Bosch GmbH |
| 18551644 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18656613 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18456093 | CONNECTOR HEIGHT UNIFORMITY OVER UNDER BUMP METAL (UBM) | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18454128 | SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18224861 | SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS | Final Rejection | Applied Materials, Inc. |
| 18735244 | LIGHT-EMITTING DIODE AND LIGHT-EMITTING DEVICE | Non-Final OA | Tianjin Sanan Optoelectronics Co., Ltd. |
| 18665769 | HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE HEAT DISSIPATION MEMBER | Non-Final OA | MIRISE Technologies Corporation |
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