Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2819 2894
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18615718 | METHOD FOR MANUFACTURING A MEMORY DEVICE AND MEMORY DEVICE MANUFACTURED THROUGH THE SAME METHOD | Non-Final OA | Micron Technology, Inc. |
| 18765021 | METHOD FOR FORMING SEMICONDUCTOR DIE PACKAGE WITH THERMAL MANAGEMENT FEATURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18456093 | CONNECTOR HEIGHT UNIFORMITY OVER UNDER BUMP METAL (UBM) | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18224861 | SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS | Final Rejection | Applied Materials, Inc. |
| 18592541 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | Non-Final OA | HON HAI PRECISION INDUSTRY CO., LTD. |
| 18536586 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy