Tech Center 2800 • Art Units: 2812 2819 2894
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18133994 | DISPLAY APPARATUS AND COVER WINDOW FOR DISPLAY APPARATUS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18213837 | PIXEL LAYOUT STRUCTURE, DISPLAY PANEL, MASK PLATE ASSEMBLY | Non-Final OA | HKC CORPORATION LIMITED |
| 18122680 | FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH | Non-Final OA | International Business Machines Corporation |
| 18456093 | CONNECTOR HEIGHT UNIFORMITY OVER UNDER BUMP METAL (UBM) | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18334802 | INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18329166 | VIAS and Via Rails for Source/Drain Metal Full Contact | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18129409 | POROUS STRUCTURE WITH MICROCHANNELS | Non-Final OA | The Board of Trustees of the University of Illinois |
| 18320432 | SEMICONDUCTOR STRUCTURE | Non-Final OA | MediaTek Singapore Pte. Ltd. |
| 18446507 | METHOD FOR FORMING CAPACITOR AND SEMICONDUCTOR DEVICE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18448917 | METHOD OF FABRICATING MEMORY DEVICES INCLUDING B-SITE DOPANTS AND LOGIC DEVICES THROUGH WAFER BONDING | Non-Final OA | Kepler Computing Inc. |
| 18448852 | METHOD OF FORMING STACKED CAPACITORS THROUGH WAFER BONDING | Non-Final OA | Kepler Computing Inc. |
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