Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18412447 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18411171 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18413360 | CAVITY INTEGRATED CIRCUIT | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18412581 | SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18660903 | SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE | Non-Final OA | Rohm Co., Ltd. |
| 18413051 | Semiconductor structure and forming method thereof | Non-Final OA | United Microelectronics Corp. |
| 18619664 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
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