Tech Center 2800 • Art Units: 2812 2817
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18460174 | METHOD AND MATERIAL SYSTEM FOR HIGH STRENGTH SELECTIVE DIELECTRIC IN HYBRID BONDING | Non-Final OA | Applied Materials, Inc. |
| 18534698 | SEMICONDUCTOR ELEMENT, ELECTRONIC DEVICE COMPRISING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR CHIP | Non-Final OA | InnoLux Corporation |
| 18456642 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18454220 | SEMICONDUCTOR PACKAGE ASSEMBLY | Non-Final OA | MEDIATEK INC. |
| 18530442 | High-Temperature Material Processing In The Absence Of Hydrogen | Non-Final OA | The Government of the United States of America, as represented by the Secretary of the Navy |
| 18568799 | METHOD FOR FORMING BARRIER LAYER | Non-Final OA | JUSUNG ENGINEERING CO., LTD. |
| 18540852 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18454746 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
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