Tech Center 1700 • Art Units: 1713 1718
This examiner grants 62% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17864541 | PLASMA CONTROL APPARATUS AND PLASMA PROCESSING SYSTEM | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18087871 | SEMICONDUCTOR PROCESSING DEVICE WITH WAFER EDGE PURGING | Final Rejection | ASM IP Holding B.V. |
| 17896218 | CVD APPARATUS AND METHOD FOR CLEANING CHAMBER OF CVD APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18424470 | SYSTEMS AND METHODS FOR HIGH-THROUGHPUT ANGLED ION PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 18113862 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18073185 | UPPER ELECTRODE AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17996524 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD | Final Rejection | Tokyo Electron Limited |
| 17903431 | SUBSTRATE SUPPORT ASSEMBLY AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17809384 | PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17845354 | SHOWER HEAD AND PLASMA PROCESSING APPARATUS | Non-Final OA | TOKYO ELECTRON LIMITED |
| 17907857 | PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | Final Rejection | Hitachi High-Tech Corporation |
| 17987456 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 17951059 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND INNER TUBE | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 17993996 | PROCESS GAS SUPPLYING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 17990715 | APPARATUS FOR TREATING SUBSTRATE | Non-Final OA | SEMES CO., LTD. |
| 17979149 | DETECTING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 17944190 | APPARATUS FOR PROCESSING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 17939174 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE | Non-Final OA | SEMES CO., LTD. |
| 17895266 | APPARATUS FOR TREATING SUBSTRATES AND TEMPERATURE CONTROL METHOD OF HEATING ELEMENTS | Non-Final OA | SEMES CO., LTD. |
| 17834154 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD | Final Rejection | SEMES CO., LTD. |
| 18168810 | WAFER PLACEMENT TABLE | Final Rejection | NGK Insulators, Ltd. |
| 17926413 | UPPER ELECTRODE MECHANISM, CURRENT CONTROL METHOD FOR RADIO FREQUENCY COIL, AND SEMICONDUCTOR PROCESSING APPARATUS | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 17934875 | SYSTEMS AND METHODS FOR DYNAMIC CONTROL OF COOLING FLUID FLOW IN AN EPITAXIAL REACTOR FOR SEMICONDUCTOR WAFER PROCESSING | Non-Final OA | GlobalWafers Co., Ltd. |
| 18043492 | ION BEAM ETCHING MACHINE AND LIFTING AND ROTATING PLATFORM DEVICE THEREOF | Non-Final OA | JIANGSU LEUVEN INSTRUMENTS CO. LTD |
| 17901640 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | WONIK IPS CO., LTD. |
| 17901252 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | WONIK IPS CO., LTD. |
| 18023934 | FILM FORMATION DEVICE | Non-Final OA | Shincron Co., Ltd. |
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