Listed by the USPTO as TIVARUS, CRISTIAN ALEXANDRU
Tech Center 2800 • Art Units: 2828 2899
This examiner grants 74% of resolved cases
TIVARUS, CRISTIAN ALEXANDRU works in USPTO tech center 2800 and art unit 2828. The profile reports 51 resolved cases, an allowance rate of 74.5%, and a median of 1253 days to allowance. The interview lift is 28.0%, indicating a positive association. The relatively limited case record means the figures should guide initial planning without replacing application-specific assessment.
Intel Corporation, Samsung Display Co., Ltd., and LG Electronics Inc. are the leading companies. The associated firms are Akona IP PC - Intel, Harrity & Harrity, LLP, and SCHWABE, WILLIAMSON & WYATT, P.C. Semiconductor and display practitioners may find the profile useful for identifying relevant technical experience and considering whether interviews should supplement written responses.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18685106 | DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18800320 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18815727 | Display Device and Head-Mounted Display Apparatus | Non-Final OA | LG Display Co., Ltd. |
| 18802352 | DISPLAY DEVICE AND METHOD OF DRIVING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18525551 | DISPLAY APPARATUS AND FABRICATION METHOD THEREOF | Final Rejection | Samsung Display Co., Ltd. |
| 18580096 | ENCAPSULATION SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL SUBSTRATE AND MANUFACTURING METHOD THEREOF | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18219018 | INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER | Non-Final OA | Intel Corporation |
| 18091555 | APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING | Final Rejection | Intel Corporation |
| 18089499 | DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING | Final Rejection | Intel Corporation |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | Final Rejection | Intel Corporation |
| 18355245 | HEAT DISSIPATION DEVICE FOR A CONVERTER FOR A VEHICLE, POWER CONVERTER, ELECTRIC AXLE DRIVE, VEHICLE AND METHOD FOR PRODUCING A HEAT DISSIPATION DEVICE | Final Rejection | ZF Friedrichshafen AG |
| 18525945 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18360873 | ELECTRONIC DEVICE WITH LEAD LOCK | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17956024 | CAPACITOR STRUCTURE TO SUPPORT VARIABLE SIGNAL AMPLITUDES IN AN ISOLATOR PRODUCT | Non-Final OA | Skyworks Solutions, Inc. |
| 17816944 | METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY | Final Rejection | Advanced Micro Devices, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy74.5% of resolved applications examined by Cristian Alexandru Tivarus were allowed (51 resolved cases), compared with 64.7% across Art Unit 2828 over the last five years.
This examiner's interview lift is +28.0 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Cristian Alexandru Tivarus took 1,253 days on average from filing to allowance.
Cristian Alexandru Tivarus examines applications in Art Unit 2828 in Tech Center 2800 (Semiconductors, Circuits & Optics).
