Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2800 2817 2829 2892 4100
This examiner grants 86% of resolved cases
Thanh Y Tran is an examiner in Tech Center 4100 and Art Unit 2800. The record contains 942 resolved cases. The allowance rate is 86.3 percent, which represents the probability of a grant. These 942 resolved cases provide a sample for analyzing the examiner's performance. This volume of cases ensures the metrics are based on a broad range of applications.
The interview lift is 9.1 percent, which shows the change in the chance of allowance following an interview. The median days to allowance is 891, representing the duration for successful prosecution. In Art Unit 2800, these metrics offer a view of the examiner's past behavior.
Practitioners should consider the 9.1 percent interview lift when deciding on a prosecution strategy. The 86.3 percent allowance rate and the 891 median days to allowance are key for managing expectations. These data points from Tech Center 4100 help in understanding the examination process.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18751563 | NONVOLATILE MEMORY DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18384152 | FAN-OUT SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18199553 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18052689 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18824288 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18465900 | LOW ENERGY AND SMALL FORM FACTOR PACKAGE | Non-Final OA | QUALCOMM Incorporated |
| 17707366 | THIN CLIENT FORM FACTOR ASSEMBLY | Non-Final OA | Intel Corporation |
| 18677480 | MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18364301 | PACKAGE STRUCTURE AND MEMORY SYSTEM | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18682978 | IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18596698 | BACKSIDE ISOLATION PILLAR REMOVAL FOR CAPACITANCE REDUCTION | Non-Final OA | International Business Machines Corporation |
| 18666369 | PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | Lodestar Licensing Group LLC |
| 18761238 | SEMICONDUCTOR PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18752388 | THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) LOW-DROPOUT (LDO) REGULATOR POWER DELIVERY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18464815 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770919 | METHODS OF FORMING EPITAXIAL STRUCTURES IN FIN-LIKE FIELD EFFECT TRANSISTORS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18786510 | SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS BETWEEN SEMICONDUCTOR DIES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18194347 | SYSTEMS AND METHODS FOR STACK CONSTRUCTION OF A SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS IN A SILICON CARRIER | Non-Final OA | Advanced Micro Devices, Inc. |
| 18167784 | ELECTRICAL PACKAGES WITH NON-LINEAR INTERCONNECT MEMBERS | Non-Final OA | Skyworks Solutions, Inc. |
| 18738801 | SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME | Non-Final OA | Sandisk Technologies, Inc. |
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