Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2829 2892
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18057305 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18272214 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18650057 | DISPLAY APPARATUS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18343118 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE SEMICONDUCTOR SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 17858031 | SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER | Final Rejection | Intel Corporation |
| 17846086 | PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES | Non-Final OA | Intel Corporation |
| 17842093 | CHIP-FIRST LAYERED PACKAGING ARCHITECTURE | Non-Final OA | Intel Corporation |
| 17707366 | THIN CLIENT FORM FACTOR ASSEMBLY | Final Rejection | Intel Corporation |
| 18111266 | SEMICONDUCTOR MEMORY DIES BONDED TO LOGIC DIES AND ASSOCIATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
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