6 pending office actions • 2 clients
| Client (Assignee) | Pending OAs |
|---|---|
| Chipletz, Inc. | 5 |
| Chipletz, Inc. | 1 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 19227262 | Through Package Vertical Interconnect and Method of Making Same | Chipletz, Inc. | NGUYEN, DONGHAI D | 3729 | Final Rejection | Jun 03, 2025 |
| 18773795 | APPARATUS AND METHOD FOR IMPROVING YIELD OF ADVANCED PACKAGES | Chipletz, Inc. | GEYER, SCOTT B | 2812 | Non-Final OA | Jul 16, 2024 |
| 18754504 | Apparatus and Method for Mitigating Crosstalk in an Advanced Package | Chipletz, Inc. | CHANG, JAY C | 2817 | Final Rejection | Jun 26, 2024 |
| 18378235 | Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in Substrates | Chipletz, Inc. | LIU, XIAOMING | 2812 | Non-Final OA | Oct 10, 2023 |
| 18206933 | Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same | Chipletz, Inc. | LOHAKARE, PRATIKSHA JAYANT | 2818 | Non-Final OA | Jun 07, 2023 |
| 18138050 | Through Package Vertical Interconnect and Method of Making Same | Chipletz, Inc. | VARGHESE, ROSHN K | 2896 | Final Rejection | Apr 22, 2023 |
IP Author helps law firms respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial