7 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 19227262 | Through Package Vertical Interconnect and Method of Making Same | NGUYEN, DONGHAI D | 3729 | Final Rejection | Jun 03, 2025 |
| 18773795 | APPARATUS AND METHOD FOR IMPROVING YIELD OF ADVANCED PACKAGES | GEYER, SCOTT B | 2812 | Non-Final OA | Jul 16, 2024 |
| 18754504 | Apparatus and Method for Mitigating Crosstalk in an Advanced Package | CHANG, JAY C | 2817 | Final Rejection | Jun 26, 2024 |
| 18378235 | Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in Substrates | LIU, XIAOMING | 2812 | Non-Final OA | Oct 10, 2023 |
| 18138050 | Through Package Vertical Interconnect and Method of Making Same | VARGHESE, ROSHN K | 2896 | Final Rejection | Apr 22, 2023 |
| 18132336 | Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive Substrate | LEPISTO, RYAN A | 2874 | Final Rejection | Apr 07, 2023 |
| 17829252 | Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive Substrate | KIELIN, ERIK J | 2814 | Final Rejection | May 31, 2022 |
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