Prosecution Insights
Last updated: April 19, 2026

Chipletz Inc.

7 pending office actions

Portfolio Summary

7
Total Pending OAs
5
Final Rejections
2
Non-Final OAs

Pending Office Actions

App #TitleExaminerArt UnitStatusFiled
19227262 Through Package Vertical Interconnect and Method of Making Same NGUYEN, DONGHAI D 3729 Final Rejection Jun 03, 2025
18773795 APPARATUS AND METHOD FOR IMPROVING YIELD OF ADVANCED PACKAGES GEYER, SCOTT B 2812 Non-Final OA Jul 16, 2024
18754504 Apparatus and Method for Mitigating Crosstalk in an Advanced Package CHANG, JAY C 2817 Final Rejection Jun 26, 2024
18378235 Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in Substrates LIU, XIAOMING 2812 Non-Final OA Oct 10, 2023
18138050 Through Package Vertical Interconnect and Method of Making Same VARGHESE, ROSHN K 2896 Final Rejection Apr 22, 2023
18132336 Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive Substrate LEPISTO, RYAN A 2874 Final Rejection Apr 07, 2023
17829252 Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive Substrate KIELIN, ERIK J 2814 Final Rejection May 31, 2022

Managing Chipletz Inc.'s Patent Portfolio?

IP Author helps IP teams respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.

Start Free Trial

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month